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WSCC 2023: Workshop on Scalable Compute Continuum (co-located with EuroPar 2023)
by Matteo Nardelli 27 Feb '23

27 Feb '23

(Our apologies if you received multiple copies of this CFP.) ************************************************************************** WSCC 2023: Euro-Par 2023 International Workshop International Workshop on Scalable Compute Continuum Date: 28 August - September 2023 Location: Limassol, Cyprus Workshop web page: https://wscc2023.di.unipi.it/ Euro-Par web page: https://2023.euro-par.org/ ************************************************************************** * Call for Papers The “Compute Continuum” paradigm promises to manage the heterogeneity and dynamism of widespread computing resources, aiming to simplify the execution of distributed applications improving data locality, performance, availability, adaptability, energy management as well as other non-functional features. This is made possible by overcoming resource fragmentation and segregation in tiers, enabling applications to be seamlessly executed and relocated along a continuum of resources spanning from the edge to the cloud. Besides consolidated vertical and horizontal scaling patterns, this paradigm also offers more detailed adaptation actions that strictly depend on the specific infrastructure components (e.g., to reduce energy consumption, or to exploit specific hardware such as GPUs and FPGAs). This enables the enhancement of latency-sensitive applications, the reduction of network bandwidth consumption, the improvement of privacy protection, and the development of novel services aimed at improving living, health, safety, and mobility. All of this should be achievable by application developers without having to worry about how and where the developed components will be executed. Therefore, to unleash the true potential offered by the Compute Continuum, proactive, autonomous, and infrastructure-aware management is desirable, if not mandatory, calling for novel interdisciplinary approaches that exploit optimization theory, control theory, machine learning, and artificial intelligence methods. In this landscape, the workshop is willing to attract contributions in the area of distributed systems with particular emphasis on support for geographically distributed platforms and autonomic features to deal with variable workloads and environmental events, and take the best of heterogeneous and distributed infrastructures. A partial list of interesting topics of this workshop is the following: - Scalable architectures and systems for Compute Continuum - System software for cloud-edge-IoT orchestration - Distributed and decentralized management of resources and application deployment in the Compute Continuum - Programming models, languages and patterns for the Compute Continuum - Compute Continuum performance modeling and analysis - Compute Continuum as a service - Energy-efficient solutions for sustainable Compute Continuum - AI in the Compute Continuum - Scalable applications for Compute Continuum (IoT, microservices, serverless) - Data-intensive and stream processing systems and applications in the Compute Continuum - Digital Twins and industry applications in the Compute Continuum - Prototypes and real-life experiments involving Compute Continuum - Benchmarks and experimental platforms for reproducible experiments in the Compute Continuum * Submission Instructions The papers should be formatted according to the LNCS guidelines. They should be between a minimum of 10 and a maximum of 12 pages. * Special Issue Authors of the accepted papers at the workshop will be invited to submit an extension of their work to the Special Issue on Scalable Compute Continuum already accepted at Elsevier Future Generation Computer Systems. * Important Dates May 5th, 2023 Paper submission deadline June 19th, 2023 Paper acceptance notifications July 2nd, 2023 Camera-ready due * Workshop Co-Chairs - Valeria Cardellini, University of Rome Tor Vergata, Italy - Patrizio Dazzi, University of Pisa, Italy - Gabriele Mencagli, University of Pisa, Italy - Matteo Nardelli, Bank of Italy, Italy - Massimo Torquati, University of Pisa, Italy Looking forward to receiving your excellent submissions soon. Best regards, Valeria Cardellini, Patrizio Dazzi, Gabriele Mencagli, Matteo Nardelli, and Massimo Torquati

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MobiSPC 2023 CFPs: The 20th International Conference on Mobile Systems and Pervasive Computing, MobiSPC
by Ali BENZERBADJ 25 Feb '23

25 Feb '23

Please accept our apologies if you receive multiple copies of this CFP ---------------------------------------------------------------------------- The 20th International Conference on Mobile Systems and Pervasive Computing (MobiSPC) Halifax, Nova Scotia, Canada July 24-26, 2023 http://cs-conferences.acadiau.ca/mobispc-23/ ---------------------------------------------------------------------------- Mobile Systems and Pervasive Computing (MobiSPC) have evolved into an active area of research and development. This is due to the tremendous advances in a broad spectrum of technologies and topics, including wireless networking, mobile and distributed computing, sensor systems, RFID technology, and the ubiquitous mobile phone. MobiSPC- solicits papers that focus on the theory, systems, practices and challenges of providing users with a successful mobile or wireless experience. This includes how mobile computing changes how people pervasively use their computers, computing resources and applications, as well the systems, services and technologies enabling those applications. MobiSPC-2023 will provide a leading-edge, scholarly forum for researchers, engineers, and students alike to share their state-of-the-art research and developmental work in the broad areas of pervasive computing and mobile systems. Important Dates ---------------- - Workshop Proposal Due: February 20, 2023 - Paper Submission Due: March 14, 2023 - Acceptance Notification: May 8, 2023 - Final Manuscript Due: June 1, 2023 Publication ------------ All MobiSPC 2023 accepted papers will be published by Elsevier Science in the open-access Procedia Computer Science series on-line. Procedia Computer Science is hosted by Elsevier on www.Elsevier.com and on Elsevier content platform ScienceDirect (www.sciencedirect.com) and will be freely available worldwide. All papers in Procedia will be indexed by Scopus ( www.scopus.com) and by Thomson Reuters' Conference Proceeding Citation Index (http://thomsonreuters.com/conference-proceedings-citation-index/) All papers in Procedia will also be indexed by Scopus (www.scopus.com) and Engineering Village (Ei) (www.engineeringvillage.com) This includes EI Compendex (www.ei.org/compendex) Moreover, all accepted papers will be indexed in DBLP (http://dblp.uni-trier.de/) The papers will contain linked references, XML versions and citable DOI numbers. You will be able to provide a hyperlink to all delegates and direct your conference website visitors to your proceedings. Selected papers will be invited for publication, in the special issues of: - International Journal of Ambient Intelligence and Humanized Computing (IF: 7.104), by Springer (http://www.springer.com/engineering/journal/12652) - International Journal of Computing and Informatics (IF: 0.524), ( http://www.cai.sk/ojs/index.php/cai/index) - International Journal of Transportation Research Part A: Policy and Practice (IF: 5.594), by Elsevier ( https://www.journals.elsevier.com/transportation-research-part-a-policy-and…) - International Journal of Computer and Telecommunications Networking (IF: 3.030) (Pending), Elsevier ( https://www.journals.elsevier.com/computer-networks) MobiSPC 2023 will be held in conjunction with the 18th International Conference on Future Networks and Communications (FNC, http://cs-conferences.acadiau.ca/fnc-23/) MobiSPC 2023 will be held in Halifax Nova Scotia, Canada. Halifax is located on the east coast of Canada and is approximately a 6-hour flight from London, UK and a 2-hour flight from Toronto, Ontario. Halifax is a vibrant and modern city which is home to multiple academic institutions and where visitors can enjoy a variety of activities and entertainment from whale watching to Jazz festivals to world-class cuisine. Halifax is also home to the Maritime Museum of the Atlantic which contains the world largest collection of Titanic artifacts. Nova Scotia is a picturesque province with many National and Provincial parks, and as stated in the Guinness Book of World Records, has the highest tides in the world. Conference Tracks --------------- - Component-based IoT - Enabling Technologies and Emerging Topics - Internet of Things - Mobile Cloud Computing - Mobile Data Management - Mobile Social Networking - Pervasive Computing - Smart Cities and Ubiquitous Climate Change Management - Smart Communities and Ubiquitous Systems - Mobile Systems and Applications Committees: ----------- General Chair Hossam Hassanein, Queen's University, Canada Program Chairs Ridha Khedri, McMaster University, Canada Ansar Yasar, Hasselt University, Belgium Workshops' Chair Stephane Galland, UTBM, France Tracks Chairs Muhammad Adnan, Hasselt University, Belgium Salimur Choudhury, Lakehead University, Canada Stéphane Galland, Université de Technologie de Belfort-Montbéliard, France Uneb Gazger, University of Bahrain, Bahrain Camille Kamga, The City College of New York, USA Faouzi Kammoun, ESPRIT, Tunisia Hamid Mcheick, UQAC, Canada Wendy Osborn, University of Lethbridge, Canada Aneta Poniszewska-Maranda, Lodz University of Technology, Poland Rahim Rahmani, Stockholm University, Sweden Qussai Yaseen, Jordan University of Science and Technology, Jordan International Journals Chair Atta Badii, Reading University, UK Publicity Chairs Ali Benzerbadj, University of Ain Temouchent Belhadj Bouchaib, Algeria Sohail Jabbar, The University of Faisalabad, Pakistan Orven E. Llantos, MSU-IIT, Philippines Jake Speiran, Acadia University, Canada Advisory Committee Nirwan Ansari, New Jersey Institute of Technology, USA Flavien Balbo, Ecole Nationale Superieure des Mines de Saint Etienne, France Erol Gelenbe, Imperial College, UK Vincenzo Loia, University of Salerno, Italy Ralf Steinmetz, Technische Universitaet Darmstadt, Germany David Taniar, Monash University, Australia Mohamed Younis, University of Maryland Baltimore County, USA Technical Program Committee http://cs-conferences.acadiau.ca/mobispc-23/#programCommittees Steering Committee Chair Elhadi Shakshuki, Acadia University, Canada

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Springer(LNCS): The Ninth International Conference on Mining Intelligence and Knowledge Exploration (MIKE 2023)
by Seifedine Kadry 25 Feb '23

25 Feb '23

Dear Colleagues, The MIKE 2023 Program Committee invites submissions of original theoretical research, applied research, and deployed application papers on all aspects of Learning Algorithms, Data / Text Mining, and Knowledge discovery techniques for the main technical program. http://www.mike.org.in/2023/#l-start Please make a note of these dates in your calendar. Workshop Proposal April 30, 2023 Full Paper Submission April 07, 2023, 11:59 PM PST Author Notification April 30, 2023 Camera Ready Copy and Registration Deadline May 10, 2023 Conference June 28-30, 2023 -- Regards, Seifedine Kadry, PhD Professor FIET, SMIEEE, ACM

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15th International Workshop on Tools and Techniques in Software Development Process(Springer(LNCS):)
by Sanjay Misra 24 Feb '23

24 Feb '23

TTSDP 2023: 15th International Workshop on Tools and Techniques in Software Development Process[image: Facebook] <http://www.facebook.com/sharer.php?u=http://www.wikicfp.com/cfp/servlet/eve…>[image: Twitter] <http://twitter.com/share?url=http://www.wikicfp.com/cfp/servlet/event.showc…>[image: LinkedIn] <http://www.linkedin.com/shareArticle?mini=true&url=http://www.wikicfp.com/c…>[image: Google] <https://plus.google.com/share?url=http://www.wikicfp.com/cfp/servlet/event.…> Link: https://sites.google.com/site/tandtinsdp/home When Jul 3, 2023 - Jul 6, 2023 Where Athens, Greece Submission Deadline Mar 26, 2023 Notification Due Apr 16, 2023 Final Version Due May 7, 2023 *Categories* <http://www.wikicfp.com/cfp/allcat> software industry <http://www.wikicfp.com/cfp/call?conference=software%20industry> industrial applications <http://www.wikicfp.com/cfp/call?conference=industrial%20applications> software techniques <http://www.wikicfp.com/cfp/call?conference=software%20techniques> software tools <http://www.wikicfp.com/cfp/call?conference=software%20tools> Call For Papers TTSDP 2023: 15th International Workshop on Tools and Techniques in Software Development Process The conference is planned to be organized in Blended form (physical presentation and online presentations). 15th International Workshop on "Tools and Techniques in Software Development Process" in conjunction with The 2023 International Conference on Computational Science and Its Applications (ICCSA 2023). It will be held during July 3 - 6, 2023, in collaboration with the National Technical University of Athens and the University of the Aegean, Athens, Greece. https://sites.google.com/site/tandtinsdp/home Accepted papers will be published in Lecture Notes in Computer Science by Springer. The extended version of all presented papers will also be invited for publication in International Scientific Journals(All indexed in SCOPUS/Web of Science/ECIE). https://www.mdpi.com/topics/Software_Engineering_Applications Submission deadline: March 26, 2023 About the Workshop and Topics The Tools and Techniques in Software Development Processes (TTSDP 2023) provide a forum for researchers, and practitioners to share their new achievements, tools, and techniques in the field of the software development process. TTSDP especially invites experience papers from industry and academia, short papers, reports, surveys, working papers/work in progress, and industrial reports. Review/Comment papers are also welcome with the limitation that the paper should be on a general problem/topic in the field (no comments are allowed on a particular paper). TTSDP covers all the aspects of the development process: process models, agile development, software engineering practices, requirements, system, and design engineering, including architectural design, software modeling, testing strategies and tactics, process and product metrics for each phase of software development, component-based software engineering, software quality, verification, validation techniques, and software project management. TTSDP 2023 invites you to submit your work that describes original and significant contributions in all areas of the software development process. The paper submitted to TTSDP 2023 must not submit elsewhere, either in a conference or journal, and should be in IEEE style. Papers selected after peer review will be included in the conference proceedings and presented virtually at the conference. TTSDP 2023 invites you to submit three different types of session papers (8 to 18 pages long) on all the above-mentioned topics: Research papers((12-18 pages in LNCS Format)): Papers that describe original and significant contributions in all areas of the software development process. Experience paper (8-11 pages in LNCS Format): papers from the field describing real-world experience related to the software development process. Short paper and reports(8-11 pages in LNCS Format): Papers that allow the explanation of ideas that are not yet fully validated. Review articles (not on a particular paper), comparative studies, and survey reports are welcome. The paper submitted to TTSDP 2023 must not have been submitted elsewhere, either in a conference or journal, and must be in LNCS style. Papers selected after review will be included in the conference proceedings and presented orally at the conference. Publication All accepted workshop (TTSDP) papers will be included in the proceeding of ICCSA 2022, published by IEEE Xplore. One of the authors of the accepted paper is required to register and is expected to present the paper at the conference. Extended and modified versions of all accepted papers are invited to publish in various journals (all Web of Science/SCOPUS/ESCI indexed) including best papers in SCIE indexed Journal. Submission site: http://ess.iccsa.org/cgi-bin/login.py IMP: While submitting to the conference site, please select the track of your submission, "15th International Workshop on Tools and Techniques in Software Development Processes (TTSDP 2023)". Proceedings Format: Please follow the Springer LNCS proceedings guidelines for preparing your paper. https://www.springer.com/gp/computer-science/lncs/conference-proceedings-gu… Special ISSUES: The accepted papers of TTSDP 2023 will be published in Lecture Notes in Computer Science and an extended version of all papers will be invited to publish in several International Journals- All Web of Science/SCOPUS Indexed Journals. Special issues in SCIE Journals- Information Technology And Controls, Applied Science, Electronics are confirmed for best papers of the software engineering symposiums(SEPA & ISSQ) and workshop(TTSDP)@ICCSA 2023). https://www.mdpi.com/topics/Software_Engineering_Applications. Important Dates March 26, 2023: Deadline for abstract and paper submission April 16, 2023: Notification of Acceptance May 7, 2023: Submission deadline for the final version of the Proceeding Paper (hard deadline) May 7, 2023: Registration ends (hard deadline). July 3-6, 2023: SEPA@ICCSA 2023 Conference in Athens, Greece Organizing Chair Sanjay Misra Ostfold University, Halden, Norway ssopam(a)gmail.com Program Chair Lov Kumar National Institute of Technology, Kurukshetra, India lovkumar(a)nitkkr.ac.in Rytis Maskeliunas Kaunas University of Technology, Lithuania rytis.Maskeliunas(a)ktu.lt International Programme Committee Members Raj Kumar Buyya, University of Melbourne, Australia Mario Fusani, National Research Council of Italy Daniel Rodríguez, University of Alcalá, Spain Robertas Damasevicius, Kaunas University of Technology, Lithuania Reda Alhajj, University of Calgary, Canada Emilia Mendes, Blekinge Institute of Technology, Sweden Vahid Garousi, Queen's University Belfast, UK Broderick Crawford, Pontificia Universidad Catolica De Valparaiso, PUCV, Chile Michel dos Santos Soares, Federal University of Sergipe, Brazil V. B. Singh, JNU, Delhi, India José Alfonso Aguilar,Universidad Autónoma de Sinaloa, Maxico Ricardo Soto, Pontificia Universidad Catolica De Valparaiso,Chile Eduardo Guerra, National Institute of space research, Sao Jose, Brazil Murat Koyuncu, Atilim University, Turkey Rytis Maskeliunas, Kaunas University of Technology, Lithuania Tolga Pustali, Cankaya University, Turkey Matthew O. Adigun, University of Zululand, South Africa Cristina Casado Lumbreras, Universidad Carlos III de Madrid, Spain Ibrahim Akman, Atilim University, Ankara, Turkey Marco Crasso, UNICEN University, Argentina Markus Holopainen, University of Helsinki, Finland Takashi Michikawa, Research Center for Advanced Science and Technology (RCAST), Japan Cristian Mateos, UNICEN University, Argentina Pham Quoc Trung, HCMC University of Technology, HCMC, Vietnam Alejandro Zunino, UNICEN University, Argentina Eudisley Anjos, Federal University of Paraiba (UFPB) – Brazil Ravin Ahuja, University Of Delhi, India Rinkaj Goyal, Guru Gobind Singh Indraprastha University, India Hector Florez, Ph.D. Universidad Distrital Francisco José de Caldas, Colombia Jeong Ah Kim. Catholic Kwandong University, Gangneun, Korea Adewole Adewumi, Algonquin College, Canada Matthew Adigun, University of Zululand, South Africa Luis Fernandez Sanz, Universidad de Alcala, Spain Ayush Dogra, CSIR-CSIO, Chandigarh, India Ayan Chatterjee, Simula Research Laboratory, Norway Hasan Ogul, Østfold University, Halden, Norway

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Springer(LNCS):15th International Symposium on Software Engineering Processes and Applications
by Sanjay Misra 24 Feb '23

24 Feb '23

SEPA 2023: 15th International Symposium Software Engineering Processes and Applications[image: Facebook] <http://www.facebook.com/sharer.php?u=http://www.wikicfp.com/cfp/servlet/eve…>[image: Twitter] <http://twitter.com/share?url=http://www.wikicfp.com/cfp/servlet/event.showc…>[image: LinkedIn] <http://www.linkedin.com/shareArticle?mini=true&url=http://www.wikicfp.com/c…>[image: Google] <https://plus.google.com/share?url=http://www.wikicfp.com/cfp/servlet/event.…> Link: https://sites.google.com/view/ssepa/home When Jul 3, 2023 - Jul 6, 2023 Where Athens, Greece Submission Deadline Mar 26, 2023 Notification Due Apr 16, 2023 Final Version Due May 7, 2023 *Categories* <http://www.wikicfp.com/cfp/allcat> software applications <http://www.wikicfp.com/cfp/call?conference=software%20applications> artificial intelligence <http://www.wikicfp.com/cfp/call?conference=artificial%20intelligence> advanced applications <http://www.wikicfp.com/cfp/call?conference=advanced%20applications> software engineering <http://www.wikicfp.com/cfp/call?conference=software%20engineering> Call For Papers SEPA 2023: 15th International Symposium on Software Engineering Processes and Applications Publisher- Springer LNCS, Special issues- in Several SCIE/SCOPUS Indexed Journal The conference is planned to be organized in Blended form (physical presentation and online presentations). The accepted papers will be published in Lecture Notes in Computer Science by Springer https://sites.google.com/view/ssepa/home http://www.iccsa.org/workshops Following the grand success of SEPA 2022(Malaga, Spain), SEPA 2021(BLENDED MODE) and SEPA 2020(Online), SEPA 2019 (in Saint Petersburg, Russia), SEPA 2018(In Melbourne, Australia), SEPA 2017(in Trieste, Italy), SEPA 2016 (in Beijing, China), SEPA 2015 (in Banff, Canada), SEPA 2014 (in Guimaraes, Portugal), SEPA 2013 (in Ho Chi Ming, Vietnam), SEPA 2012 (in Salvador, Brazil), SEPA 2011 (in Santander, Spain), SEPA 2010 (in Fukuoka, Japan), SEPA 2009 (in Sowon, Korea), SEPA 2022 (in conjunction with ICCSA 2022) is scheduled to be held during July 3 - 6, 2023 in collaboration with the National Technical University of Athens and the University of the Aegean, Athens, Greece. Submission deadline: March 26, 2023 About the Workshop and Topics Software Engineering Processes and Applications (SEPA: 2023) is aimed to provide a forum to scientists/researchers/engineers/practitioners and academicians to share their ideas, experiences, and research in the field of software engineering processes and applications. SEPA 2023 covers all the frontier issues and trends in modern software development processes. It includes process models, the development processes for different software platforms (e.g., social networks, cloud), a process for adaptive, dependable, embedded systems, agile development, software engineering practices, requirements, system, and design engineering including architectural design, component-level design, formal methods, software modeling, testing strategies and tactics, process and product metrics, Web Engineering, project management, risk management, and configuration management. SEPA also invites papers for the development process of the software/software systems in application areas e.g. agriculture, aviation industry, business, cyber-crime, education, government, military, etc. SEPA invites you to submit theme papers that describe original and significant contributions in all the above-mentioned areas of software engineering processes. The paper submitted to SEPA 2023 must not be submitted elsewhere, either in a conference or journal, and should be 12 - 16 pages (LNCS style). Papers selected after peer review will be included in the Lecture Notes in Computer Science published by Springer (only after completing the registration) and presented online. Publication All contributions will be reviewed by international program committee members and judged on their quality and relevance. The accepted papers for SEPA 2023 will be published in Lecture Notes in Computer Science as a book series of Computational Science and Its Applications: ICCSA. Please note that one of the authors of the accepted paper should be registered and supposed to present the paper at the conference (virtual presentation is allowed for authors who cannot attend the conference). The extended version of selected papers will also be invited for publication in several journals (All Web of Science and SCOPUS-indexed journals), including the best papers in SCIE-indexed journals*. *Special issues In SCIE Journals- Information Technology And Controls, Applied Science, Electronics are confirmed for best papers of the software engineering symposiums(SEPA & ISSQ) and workshop(TTSDP)@ICCSA 2023). https://www.mdpi.com/topics/Software_Engineering_Applications Submission Please submit your paper through ICCSA 2023 conference website. Submission site: http://ess.iccsa.org/cgi-bin/login.py while submitting to the conference site, please select the track of your submission, "15th International Symposium on Software Engineering Processes and Applications (SEPA 2023)". Important Dates: March 26, 2023: Deadline for abstract and paper submission April 16, 2023: Notification of Acceptance May 7, 2023: Submission deadline for the final version of the Proceeding Paper (hard deadline) May 7, 2023: Registration ends (hard deadline). July 3-6, 2023: SEPA@ICCSA 2023 Conference in Athens, Greece International Program Committee Organizing Chair (Contact) Sanjay Misra Department of Computer Science and Communication Østfold University College, Halden, Norway ssopam(a)gmail.com Programme Committee Chair Robertas Damasevicius Department of Software Engineering Kaunas University of Technology, Kaunas, Lithuania robertas.damasevicius(a)ktu.lt International Programme Committee Members Raj Kumar Buyya, University of Melbourne, Australia Mario Fusani, National Research Council of Italy Daniel Rodríguez, University of Alcalá, Spain Robertas Damasevicius, Kaunas University of Technology, Lithuania Reda Alhajj, University of Calgary, Canada Emilia Mendes, Blekinge Institute of Technology, Sweden Vahid Garousi, Queen's University Belfast, UK Broderick Crawford, Pontificia Universidad Catolica De Valparaiso, PUCV, Chile Michel dos Santos Soares, Federal University of Sergipe, Brazil V. B. Singh, JNU, Delhi, India José Alfonso Aguilar,Universidad Autónoma de Sinaloa, Maxico Ricardo Soto, Pontificia Universidad Catolica De Valparaiso,Chile Eduardo Guerra, National Institute of space research, Sao Jose, Brazil Murat Koyuncu, Atilim University, Turkey Rytis Maskeliunas, Kaunas University of Technology, Lithuania Tolga Pustali, Cankaya University, Turkey Matthew O. Adigun, University of Zululand, South Africa Cristina Casado Lumbreras, Universidad Carlos III de Madrid, Spain Ibrahim Akman, Atilim University, Ankara, Turkey Marco Crasso, UNICEN University, Argentina Markus Holopainen, University of Helsinki, Finland Takashi Michikawa, Research Center for Advanced Science and Technology (RCAST), Japan Cristian Mateos, UNICEN University, Argentina Pham Quoc Trung, HCMC University of Technology, HCMC, Vietnam Alejandro Zunino, UNICEN University, Argentina Eudisley Anjos, Federal University of Paraiba (UFPB) – Brazil Ravin Ahuja, University Of Delhi, India Rinkaj Goyal, Guru Gobind Singh Indraprastha University, India Hector Florez, Ph.D. Universidad Distrital Francisco José de Caldas, Colombia Jeong Ah Kim. Catholic Kwandong University, Gangneun, Korea Adewole Adewumi, Algonquin College, Canada Matthew Adigun, University of Zululand, South Africa Luis Fernandez Sanz, Universidad de Alcala, Spain Ayush Dogra, CSIR-CSIO, Chandigarh, India Ayan Chatterjee, Simula Research Laboratory, Norway Hasan Ogul, Østfold University, Halden, Norway

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Springer(LNCS):14th International Symposium on Software Quality
by Sanjay Misra 24 Feb '23

24 Feb '23

ISSQ 2023: 14th International Symposium on Software Quality[image: Facebook] <http://www.facebook.com/sharer.php?u=http://www.wikicfp.com/cfp/servlet/eve…>[image: Twitter] <http://twitter.com/share?url=http://www.wikicfp.com/cfp/servlet/event.showc…>[image: LinkedIn] <http://www.linkedin.com/shareArticle?mini=true&url=http://www.wikicfp.com/c…>[image: Google] <https://plus.google.com/share?url=http://www.wikicfp.com/cfp/servlet/event.…> Link: https://sites.google.com/view/issq/home When Jul 3, 2023 - Jul 6, 2023 Where Athens, Greece Submission Deadline Mar 26, 2023 Notification Due Apr 16, 2023 Final Version Due May 7, 2023 *Categories* <http://www.wikicfp.com/cfp/allcat> software quality assurance <http://www.wikicfp.com/cfp/call?conference=software%20quality%20assurance> quality standards <http://www.wikicfp.com/cfp/call?conference=quality%20standards> quality models <http://www.wikicfp.com/cfp/call?conference=quality%20models> quality practics <http://www.wikicfp.com/cfp/call?conference=quality%20practics> Call For Papers ISSQ 2023: 14th International Symposium on Software Quality(Springer-LNCS) in conjunction with ICCSA 2023 The conference is planned to be organized in Blended form (physical presentation and online presentations). The accepted papers of ISSQ 2023 will be published in Lecture Notes in Computer Science and an extended version of all papers will be invited to publish in several International Journals- All Web of Science/SCOPUS Indexed Journals. Special issues in SCIE Journals- Information Technology And Controls, Applied Science, Electronics are confirmed for best papers of the software engineering symposiums(SEPA & ISSQ) and workshop(TTSDP)@ICCSA 2023. https://www.mdpi.com/topics/Software_Engineering_Applications) Following the grand success of ISSQ 2022(Malaga, Spain), ISSQ 2021(Blended form in Cagliari, Italy (2021)), ISSQ 2020 (Online), ISSQ 2019 (in Saint Petersburg, Russia),, ISSQ 2018(In Melbourne, Australia), ISSQ 2017(in Trieste, Italy), SQ 2016(in Beijing, China), SQ 2015(in Banff, Canada), SQ 2014 (in Guimaraes, Portugal), SQ 2013 (in Ho Chi Minh City, Vietnam), SQ 2012 (in Salvador, Brazil), SQ 2011 in conjunction with ICCSA 2011 (in Santander, Spain), and SQ 2009 in ISCIS 2009 (in Middle East Technical University North Cyprus Campus, Cyprus), ISSQ 2023 (in conjunction with ICCSA 2023) is scheduled to be held during July 3 - 6, 2023 in collaboration with the National Technical University of Athens and the University of the Aegean, Athens, Greece. Submission deadline: March 26, 2023 About the Workshop and Topics This symposium extends the discussion of software quality issues in modern software development processes. It covers s all the aspects of process and product quality, quality assurance and standards, quality planning, quality control, and software quality challenges. It also covers the frontier issues and trends for achieving quality objectives. It includes the quality management process, the role of software metrics, predictor metrics, and control metrics, the role of measurement in accessing the quality, and limitations. Topics include (related to quality issues in software, software applications in any related area-cloud, agile, IoT, Big data, smart applications) but not limited to: 1. Software development fundamentals, 2. Extreme Programming (XP), Agile, Scrum, 3. Software requirements techniques, 4. Software testing & QA fundamentals, 5. Software testing models and approaches, 6. Software testing tools and frameworks, 7. Software test design, 8. Types of software maintenance, 9. Software maintenance process models, 10. Software maintenance standards, 11. Software maintenance tools 12. Software Reviews (SR) 13. Software Metrics (SM) 14. Software Process Assessment (SPA) 15. Software Process Improvement (SPI) 16. Software Standardization and Certification ISSQ: 2023 invites you to submit your work that describes original and significant contributions in all the above-mentioned areas of software engineering processes. The paper submitted to ISSQ 2023 must not be submitted elsewhere, either in a conference or journal. Papers selected after peer review will be included in the conference proceedings (after registration) and presented virtually at the conference. Publication All contributions will be peer-reviewed and will be judged on their quality and relevance. The accepted papers for ISSQ 2023 will be published in Proceedings of ICCSA by Springer in Lecture Notes in Computer Science. Please note that one of the authors of the accepted paper must register for the conference. Extended and modified versions of all accepted papers are invited to publish in various journals (all SCIE/Web of Science/SCOPUS/ESCI indexed) including best papers in SCIE-indexed Journals. Submission Please submit your paper through ICCSA 2023 conference website. Submission site: http://ess.iccsa.org/cgi-bin/login.py IMP: While submitting to the conference site, please check the track of your submission "14th International Symposium on Software Quality (ISSQ 2023)" Important Dates March 26, 2023: Deadline for abstract and paper submission April 16, 2023: Notification of Acceptance May 7, 2023: Submission deadline for the final version of the Proceeding Paper (hard deadline) May 7, 2023: Registration ends (hard deadline). July 3-6, 2023: SEPA@ICCSA 2023 Conference in Athens, Greece Organizing Chair Sanjay Misra Østfold University, Halden, Norway Contact: sanjay.misra(a)hiof.no, ssopam(a)gmail.com Programme Committee Chair Luis Fernandez-Sanz Department of Computer Science University De Alcala, Spain luis.Fernandez.sanz(a)uah.es International Programme Committee Members Raj Kumar Buyya, University of Melbourne, Australia Mario Fusani, National Research Council of Italy Daniel Rodríguez, University of Alcalá, Spain Robertas Damasevicius, Kaunas University of Technology, Lithuania Reda Alhajj, University of Calgary, Canada Emilia Mendes, Blekinge Institute of Technology, Sweden Vahid Garousi, Queen's University Belfast, UK Broderick Crawford, Pontificia Universidad Catolica De Valparaiso, PUCV, Chile Michel dos Santos Soares, Federal University of Sergipe, Brazil V. B. Singh, JNU, Delhi, India José Alfonso Aguilar,Universidad Autónoma de Sinaloa, Maxico Ricardo Soto, Pontificia Universidad Catolica De Valparaiso,Chile Eduardo Guerra, National Institute of space research, Sao Jose, Brazil Murat Koyuncu, Atilim University, Turkey Rytis Maskeliunas, Kaunas University of Technology, Lithuania Tolga Pustali, Cankaya University, Turkey Matthew O. Adigun, University of Zululand, South Africa Cristina Casado Lumbreras, Universidad Carlos III de Madrid, Spain Ibrahim Akman, Atilim University, Ankara, Turkey Marco Crasso, UNICEN University, Argentina Markus Holopainen, University of Helsinki, Finland Takashi Michikawa, Research Center for Advanced Science and Technology (RCAST), Japan Cristian Mateos, UNICEN University, Argentina Pham Quoc Trung, HCMC University of Technology, HCMC, Vietnam Alejandro Zunino, UNICEN University, Argentina Eudisley Anjos, Federal University of Paraiba (UFPB) – Brazil Ravin Ahuja, University Of Delhi, India Rinkaj Goyal, Guru Gobind Singh Indraprastha University, India Hector Florez, Ph.D. Universidad Distrital Francisco José de Caldas, Colombia Jeong Ah Kim. Catholic Kwandong University, Gangneun, Korea Adewole Adewumi, Algonquin College, Canada Matthew Adigun, University of Zululand, South Africa Luis Fernandez Sanz, Universidad de Alcala, Spain Ayush Dogra, CSIR-CSIO, Chandigarh, India Ayan Chatterjee, Simula Research Laboratory, Norway Hasan Ogul, Østfold University, Halden, Norway

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Call for Submissions for IJHCITP(Scopus indexed, will get its first impact factor in june 2023))
by Sanjay Misra 24 Feb '23

24 Feb '23

Dear Colleagues I would like to take this opportunity and personally invite you to consider submitting a manuscript based on your recent research project to the International Journal of Human Capital and Information Technology Professionals (IJHCITP), an ESCI-Indexed Gold Open Access Journal, published by IGI Global Publishing House. As IJHCITP is an open-access journal, it publishes research that is fully and freely accessible immediately upon publication to millions of researchers worldwide which will offer your published paper an *89% higher download rate* and higher citation impact. CALL FOR SUBMISSIONS *International Journal of Human Capital and Information Technology Professionals (IJHCITP)* *A Gold Open Access Journal* *Editor-in-Chief:* Dr. Sanjay Misra <https://www.igi-global.com/affiliate/sanjay-misra/346944/> ( Østfold University College ,Norway ) *Indexed In: * INSPEC, SCOPUS, Web of Science Emerging Sources Citation Index (ESCI) and 10 more indices <https://www.igi-global.com/journal/international-journal-human-capital-info…> Published: Continuous Volume by IGI Global, USA Established: 2010 ISSN: 1947-3478|EISSN: 1947-3486|DOI: 10.4018/IJHCITP [image: Logo Description automatically generated] <https://www.igi-global.com/submission/submit-manuscript/?jid=1152> Free Full Text Access <https://www.igi-global.com/journals/open-access/table-of-contents/internati…> [image: Icon Description automatically generated]*Article Process Charge (APC)* Papers are published under Creative Commons licensing and are freely accessible worldwide; therefore, there is an APC required to cover publishing costs (which replaces revenue generated from traditional subscriptions). Learn more about *APCs* <https://www.igi-global.com/newsroom/archive/article-processing-charges-they…>, *creative commons licensing* <https://creativecommons.org/get-cc-savvy/breaking-cc-licenses/>, and *funding resources*. <https://www.igi-global.com/open-access-publishing/funding-resources/> *Important Educational Resources About Open Access Publishing:* Hear Perspectives About OA Publishing From Researchers Around the World *Read More>* <https://www.igi-global.com/newsroom/archive/igi-global-2022-open-access/543…> Exposing Common Misconceptions About Open Access Publishing *Read More>* <https://www.igi-global.com/publish/contributor-resources/open-access/#faq> Article Processing Charges: What They Are and Why They Exist *Read More>* <https://www.igi-global.com/newsroom/archive/article-processing-charges-they…> *IJHCITP *focuses on the IT field from the outlook of industry professionals and covers multidisciplinary themes such as human resource management, sociology, psychology, and management along with technology itself. Learn more here <https://www.igi-global.com/journal/international-journal-human-capital-info…> . *Currently Seeking Submissions in the Following Research* *Areas: * - Competence management within the IT profession - Ethics, as well as professional and social responsibilities of IT professionals - Human capital within the IT industry - Human resource management in the IT sector - IT careers - IT professionalism - IT professionals assessment methods - IT professionals roles - IT professionals under the scope of IT governance - Licensing and certifying of IT professionals - And more *Review some of the Recently Published IJHCITP Articles (Free Full-Text Access):* - Challenges of the Fourth Industrial Revolution in HRM <https://www.igi-global.com/article/challenges-of-the-fourth-industrial-revo…> - Diversity Climate Perceptions and Turnover Intentions: Evidence From the Indian IT Industry <https://www.igi-global.com/article/diversity-climate-perceptions-and-turnov…> - Exploring DSS for Personality Assessment: Influence of Personality on Citizenship <https://www.igi-global.com/article/exploring-dss-for-personality-assessment…> - Browse More Content <https://www.igi-global.com/journals/open-access/table-of-contents/internati…> <https://www.igi-global.com/submission/submit-manuscript/?jid=1152> Free Full Text Access <https://www.igi-global.com/journals/open-access/table-of-contents/internati…> <https://www.igi-global.com/publish/contributor-resources/open-access/> *Why Should You Publish* *OA With IGI Global?* - 175+ Highly Indexed Journals to Choose From (including IJHCITP) - Easily Track Your Work in IGI Global’s Advanced Manuscript Submission System with Rapid Turnaround Times - Double-Blind Peer Review by Notable Editorial Boards (Committee on Publication Ethics (COPE) Certified) - Publications Adhere to All Current OA Mandates & Compliances - Affordable APCs (Often 50% Lower Than the Industry Average) Including Robust Editorial Service Provisions - Direct Connections With Prominent Research Funders & OA Regulatory Groups - Institution Level OA Agreements Available (Recommend or Contact Your Librarian for Details) - Join a Diverse Community of 150,000+ Researchers Worldwide Publishing With IGI Global - Content Spread Widely to Leading Repositories (ResearchGate <https://www.researchgate.net/>, CORE <https://core.ac.uk/>, AGOSR <https://agosr.com/>, & More) You can learn more about publishing under OA with IGI Global here. <https://www.igi-global.com/publish/contributor-resources/open-access/> Additionally, please feel free to share this call for papers with your relevant colleagues and professional networks that would find this of interest. You can also find additional information about IJHCITP by accessing its webpage here <https://www.igi-global.com/journal/international-journal-human-capital-info…>. Alternatively, you can contact me at ijhcitp(a)igi-global.com or IGI Global’s Open Access Team at openaccessadmin(a)igi-global.com. We are available to discuss any questions you may have about publishing OA with IGI Global in this journal. Best Regards, Sanjay Misra, EIC, IJHCITP [image: IGI Global Logo] <https://www.igi-global.com/>[image: World Forgotten Children Foundation Logo] <https://www.worldforgottenchildren.org/> *Publisher of Peer-Reviewed, Timely, and Innovative Academic Research for Over 30 Years* 701 East Chocolate Avenue, Hershey, Pennsylvania 17033-1240, USA Tel: 717-533-8845 (ext. *132*); Fax: 717-533-8661 E-Mail: bhaynes(a)igi-global.com; www.igi-global.com *IGI Global is committed to the highest quality standards as a FULL member of the Committee on Publication Ethics (COPE)* Follow us on Facebook <https://www.facebook.com/IGIglobal?utm_source=IGI+Global+Products+and+Publi…>, Twitter <https://twitter.com/igiglobal/?camid=3v6&utm_source=IGI+Global+Products+and…>, & LinkedIn <https://www.linkedin.com/company/743096/?utm_source=IGI+Global+Products+and…> for special offers and updates! <><><><><><><><><><><><><><><><><><><><><><><><><><><><><><><><><><><><><><><><><><><><><><><><><><><> *The information contained in this communication may be confidential, is intended only for the use of the recipient named above and may be legally privileged. If the reader of this message is not the intended recipient, **the reader is hereby notified that any dissemination, distribution, or copying of this communication and any of its contents is strictly prohibited. If you have received this communication in error, please re-send this communication to the sender and delete the original message and any copy of it from your computer system.*

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The Workshop on Mathematical Methods for Image Processing and Understanding
by Ivan Gerace 24 Feb '23

24 Feb '23

Dear Colleagues, we are writing to invite you to submit your paper for consideration at the upcoming Workshop on Mathematical Methods for Image Processing and Understanding MIMUP 2023. The workshop will be held in conjunction with the 2023 International Conference on Computational Science and its Applications (ICCSA 2023) in Athens, Greece on July 3-6, 2023. We welcome submissions from colleagues in all fields related to Image Processing and Understanding. Your paper should be in the form of a research paper and we encourage submissions that explore new ideas or challenge existing paradigms in the field. The deadline for submission is March 31, 2023, and all submissions will be reviewed by the workshop committee. We will notify you of the committee's decision by April 16, 2023. If you are interested in submitting your paper, please follow the instructions on the workshop website https://sites.google.com/view/mmipu-2023/home-page [https://lh6.googleusercontent.com/TGG2M8c9t1bXz_m5_-H6z1xGRLBo_-l8oEMNwarBI…]<https://sites.google.com/view/mmipu-2023/home-page> MMIPU 2023<https://sites.google.com/view/mmipu-2023/home-page> The Workshop on Mathematical Methods for Image Processing and Understanding will be held in conjunction with the 2023 International Conference on Computational Science and its Applications (ICCSA 2023) in Athens, Greece on July 3-6, 2023: sites.google.com If you have any questions about the submission process, please do not hesitate to contact us. Thank you for your attention, and we look forward to your submission. Best regards, Ivan Gerace Gianluca Vinti Arianna Travaglini

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Special Issue on Industrial IoT networks to support future Cloud-to-Things applications – Ad Hoc Networks, Elsevier –
by Francesca Righetti 23 Feb '23

23 Feb '23

Please consider to submit your paper: Special Issue on Industrial IoT networks to support future Cloud-to-Things applications – Ad Hoc Networks, Elsevier – The Cloud-to-Things (C2T) continuum is a novel paradigm that extends the cloud-computing centralized architecture by introducing intermediate computing layers to host industrial applications and services with stringent requirements in terms of latency and reliability in the communication with IoT devices and sensors. Recent network architectures that support the integration of IoT devices into existing networks, like 6TiSCH or 5G/6G, include by design support for strict Quality of Service (QoS) communication requirements to ensure timed and reliable data delivery between applications and IoT devices. The deployment and management of the C2T multi-tier computing infrastructure connected with industrial IoT via heterogeneous communication technologies on a large-scale will require innovative approaches to guarantee QoS application requirements by enabling the convergence between computing and networking. Current networking management approaches are not adequate to support this convergence, thus leading to research open issues in multiple areas, including, for instance, IoT networks performance optimization, efficient resource management, scalable device management, novel compute-network joint management strategies, etc. In this special issue, we look for original and high-quality research works in these areas to enable the convergence between networking and computing in the C2T continuum for industrial applications. The topics relevant to this special issue include but are not limited to: *Network resource allocation and management in Industrial IoT networks *Integration between cloud-edge infrastructure and 5G/6G networks for the Industrial IoT *Network continuity to support efficient offloading to optimize network performance *Network strict-QoS for Industrial applications in the C2T continuum *Joint network configuration and workload distribution in the C2T continuum *Security issues and solutions for industrial systems in the C2T continuum *Ad-Hoc Networks for industrial applications to support mobility *Vehicular networks for cooperative autonomous vehicles *Self-organizing networks in the C2T continuum *Scalable management solutions in the C2T continuum *Novel network paradigms to support the C2T continuum with QoS guarantees Guest editors: Jiannong Cao, Hong Kong Polytechnic University,jiannong.cao(a)polyu.edu.hk<mailto:jiannong.cao@polyu.edu.hk> Sajal K. Das, Missouri University of Science and Technology, sdas(a)mst.edu<mailto:sdas@mst.edu> Francesca Righetti, University of Pisa, francesca.righetti(a)unipi.it<mailto:francesca.righetti@unipi.it> Carlo Vallati, University of Pisa, carlo.vallati(a)unipi.it<mailto:carlo.vallati@unipi.it> Manuscript submission information: The ADHOC's submission system (Editorial Manager®<https://www.editorialmanager.com/adhoc/default2.aspx>) will be open for submissions to our Special Issue from January 10th, 2023.When submitting your manuscript please select the article type VSI:IIoT for C2T applications. Important Dates: - Manuscript submission deadline: May 30, 2023 - Final Notification: January 30, 2024 https://www.sciencedirect.com/journal/ad-hoc-networks/about/call-for-papers…

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MobiSPC 2023 CFPs: The 20th International Conference on Mobile Systems and Pervasive Computing, MobiSPC
by Ali BENZERBADJ 23 Feb '23

23 Feb '23

Please accept our apologies if you receive multiple copies of this CFP ---------------------------------------------------------------------------- The 20th International Conference on Mobile Systems and Pervasive Computing (MobiSPC) Halifax, Nova Scotia, Canada July 24-26, 2023 http://cs-conferences.acadiau.ca/mobispc-23/ ---------------------------------------------------------------------------- Mobile Systems and Pervasive Computing (MobiSPC) have evolved into an active area of research and development. This is due to the tremendous advances in a broad spectrum of technologies and topics, including wireless networking, mobile and distributed computing, sensor systems, RFID technology, and the ubiquitous mobile phone. MobiSPC- solicits papers that focus on the theory, systems, practices and challenges of providing users with a successful mobile or wireless experience. This includes how mobile computing changes how people pervasively use their computers, computing resources and applications, as well the systems, services and technologies enabling those applications. MobiSPC-2023 will provide a leading-edge, scholarly forum for researchers, engineers, and students alike to share their state-of-the-art research and developmental work in the broad areas of pervasive computing and mobile systems. Important Dates ---------------- - Workshop Proposal Due: February 20, 2023 - Paper Submission Due: March 14, 2023 - Acceptance Notification: May 8, 2023 - Final Manuscript Due: June 1, 2023 Publication ------------ All MobiSPC 2023 accepted papers will be published by Elsevier Science in the open-access Procedia Computer Science series on-line. Procedia Computer Science is hosted by Elsevier on www.Elsevier.com and on Elsevier content platform ScienceDirect (www.sciencedirect.com) and will be freely available worldwide. All papers in Procedia will be indexed by Scopus ( www.scopus.com) and by Thomson Reuters' Conference Proceeding Citation Index (http://thomsonreuters.com/conference-proceedings-citation-index/) All papers in Procedia will also be indexed by Scopus (www.scopus.com) and Engineering Village (Ei) (www.engineeringvillage.com) This includes EI Compendex (www.ei.org/compendex) Moreover, all accepted papers will be indexed in DBLP (http://dblp.uni-trier.de/) The papers will contain linked references, XML versions and citable DOI numbers. You will be able to provide a hyperlink to all delegates and direct your conference website visitors to your proceedings. Selected papers will be invited for publication, in the special issues of: - International Journal of Ambient Intelligence and Humanized Computing (IF: 7.104), by Springer (http://www.springer.com/engineering/journal/12652) - International Journal of Computing and Informatics (IF: 0.524), ( http://www.cai.sk/ojs/index.php/cai/index) - International Journal of Transportation Research Part A: Policy and Practice (IF: 5.594), by Elsevier ( https://www.journals.elsevier.com/transportation-research-part-a-policy-and…) - International Journal of Computer and Telecommunications Networking (IF: 3.030) (Pending), Elsevier ( https://www.journals.elsevier.com/computer-networks) MobiSPC 2023 will be held in conjunction with the 18th International Conference on Future Networks and Communications (FNC, http://cs-conferences.acadiau.ca/fnc-23/) MobiSPC 2023 will be held in Halifax Nova Scotia, Canada. Halifax is located on the east coast of Canada and is approximately a 6-hour flight from London, UK and a 2-hour flight from Toronto, Ontario. Halifax is a vibrant and modern city which is home to multiple academic institutions and where visitors can enjoy a variety of activities and entertainment from whale watching to Jazz festivals to world-class cuisine. Halifax is also home to the Maritime Museum of the Atlantic which contains the world largest collection of Titanic artifacts. Nova Scotia is a picturesque province with many National and Provincial parks, and as stated in the Guinness Book of World Records, has the highest tides in the world. Conference Tracks --------------- - Component-based IoT - Enabling Technologies and Emerging Topics - Internet of Things - Mobile Cloud Computing - Mobile Data Management - Mobile Social Networking - Pervasive Computing - Smart Cities and Ubiquitous Climate Change Management - Smart Communities and Ubiquitous Systems - Mobile Systems and Applications Committees: ----------- General Chair Hossam Hassanein, Queen's University, Canada Program Chairs Ridha Khedri, McMaster University, Canada Ansar Yasar, Hasselt University, Belgium Workshops' Chair Stephane Galland, UTBM, France Tracks Chairs Muhammad Adnan, Hasselt University, Belgium Salimur Choudhury, Lakehead University, Canada Stéphane Galland, Université de Technologie de Belfort-Montbéliard, France Uneb Gazger, University of Bahrain, Bahrain Camille Kamga, The City College of New York, USA Faouzi Kammoun, ESPRIT, Tunisia Hamid Mcheick, UQAC, Canada Wendy Osborn, University of Lethbridge, Canada Aneta Poniszewska-Maranda, Lodz University of Technology, Poland Rahim Rahmani, Stockholm University, Sweden Qussai Yaseen, Jordan University of Science and Technology, Jordan International Journals Chair Atta Badii, Reading University, UK Publicity Chairs Ali Benzerbadj, University of Ain Temouchent Belhadj Bouchaib, Algeria Sohail Jabbar, The University of Faisalabad, Pakistan Orven E. Llantos, MSU-IIT, Philippines Jake Speiran, Acadia University, Canada Advisory Committee Nirwan Ansari, New Jersey Institute of Technology, USA Flavien Balbo, Ecole Nationale Superieure des Mines de Saint Etienne, France Erol Gelenbe, Imperial College, UK Vincenzo Loia, University of Salerno, Italy Ralf Steinmetz, Technische Universitaet Darmstadt, Germany David Taniar, Monash University, Australia Mohamed Younis, University of Maryland Baltimore County, USA Technical Program Committee http://cs-conferences.acadiau.ca/mobispc-23/#programCommittees Steering Committee Chair Elhadi Shakshuki, Acadia University, Canada

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