*Highlights:* TTSDP 2023 covers tools and techniques for real-life and industrial applications, Publication in the most reputed series of Springer(LNCS), has low registration(*180€*) for online presentations, and is indexed in CORE, SCOPUS, and Web of Science TTSDP 2023: 15th International Workshop on Tools and Techniques in Software Development Process[image: Facebook] <http://www.facebook.com/sharer.php?u=http://www.wikicfp.com/cfp/servlet/event.showcfp?eventid=171727>[image: Twitter] <http://twitter.com/share?url=http://www.wikicfp.com/cfp/servlet/event.showcfp?eventid=171727&text=TTSDP%202023%20:%2015th%20International%20Workshop%20on%20Tools%20and%20Techniques%20in%20Software%20Development%20Process>[image: LinkedIn] <http://www.linkedin.com/shareArticle?mini=true&url=http://www.wikicfp.com/cfp/servlet/event.showcfp?eventid=171727>[image: Google] <https://plus.google.com/share?url=http://www.wikicfp.com/cfp/servlet/event.showcfp?eventid=171727> Link: https://sites.google.com/site/tandtinsdp/home When Jul 3, 2023 - Jul 6, 2023 Where Athens, Greece Submission Deadline Mar 26, 2023 Notification Due Apr 16, 2023 Final Version Due May 7, 2023 *Categories* <http://www.wikicfp.com/cfp/allcat> software industry <http://www.wikicfp.com/cfp/call?conference=software%20industry> industrial applications <http://www.wikicfp.com/cfp/call?conference=industrial%20applications> software techniques <http://www.wikicfp.com/cfp/call?conference=software%20techniques> software tools <http://www.wikicfp.com/cfp/call?conference=software%20tools> Call For Papers TTSDP 2023: 15th International Workshop on Tools and Techniques in Software Development Process The conference is planned to be organized in Blended form (physical presentation and online presentations). 15th International Workshop on "Tools and Techniques in Software Development Process" in conjunction with The 2023 International Conference on Computational Science and Its Applications (ICCSA 2023). It will be held during July 3 - 6, 2023, in collaboration with the National Technical University of Athens and the University of the Aegean, Athens, Greece. https://sites.google.com/site/tandtinsdp/home Accepted papers will be published in Lecture Notes in Computer Science by Springer. The extended version of all presented papers will also be invited for publication in International Scientific Journals(All indexed in SCOPUS/Web of Science/ECIE). https://www.mdpi.com/topics/Software_Engineering_Applications Submission deadline: March 26, 2023 About the Workshop and Topics The Tools and Techniques in Software Development Processes (TTSDP 2023) provide a forum for researchers, and practitioners to share their new achievements, tools, and techniques in the field of the software development process. TTSDP especially invites experience papers from industry and academia, short papers, reports, surveys, working papers/work in progress, and industrial reports. Review/Comment papers are also welcome with the limitation that the paper should be on a general problem/topic in the field (no comments are allowed on a particular paper). TTSDP covers all the aspects of the development process: process models, agile development, software engineering practices, requirements, system, and design engineering, including architectural design, software modeling, testing strategies and tactics, process and product metrics for each phase of software development, component-based software engineering, software quality, verification, validation techniques, and software project management. TTSDP 2023 invites you to submit your work that describes original and significant contributions in all areas of the software development process. The paper submitted to TTSDP 2023 must not submit elsewhere, either in a conference or journal, and should be in IEEE style. Papers selected after peer review will be included in the conference proceedings and presented virtually at the conference. TTSDP 2023 invites you to submit three different types of session papers (8 to 18 pages long) on all the above-mentioned topics: Research papers((12-18 pages in LNCS Format)): Papers that describe original and significant contributions in all areas of the software development process. Experience paper (8-11 pages in LNCS Format): papers from the field describing real-world experience related to the software development process. Short paper and reports(8-11 pages in LNCS Format): Papers that allow the explanation of ideas that are not yet fully validated. Review articles (not on a particular paper), comparative studies, and survey reports are welcome. The paper submitted to TTSDP 2023 must not have been submitted elsewhere, either in a conference or journal, and must be in LNCS style. Papers selected after review will be included in the conference proceedings and presented orally at the conference. Publication All accepted workshop (TTSDP) papers will be included in the proceeding of ICCSA 2022, published by IEEE Xplore. One of the authors of the accepted paper is required to register and is expected to present the paper at the conference. Extended and modified versions of all accepted papers are invited to publish in various journals (all Web of Science/SCOPUS/ESCI indexed) including best papers in SCIE indexed Journal. Submission site: http://ess.iccsa.org/cgi-bin/login.py IMP: While submitting to the conference site, please select the track of your submission, "15th International Workshop on Tools and Techniques in Software Development Processes (TTSDP 2023)". Proceedings Format: Please follow the Springer LNCS proceedings guidelines for preparing your paper. https://www.springer.com/gp/computer-science/lncs/conference-proceedings-gui... Special ISSUES: The accepted papers of TTSDP 2023 will be published in Lecture Notes in Computer Science and an extended version of all papers will be invited to publish in several International Journals- All Web of Science/SCOPUS Indexed Journals. Special issues in SCIE Journals- Information Technology And Controls, Applied Science, Electronics are confirmed for best papers of the software engineering symposiums(SEPA & ISSQ) and workshop(TTSDP)@ICCSA 2023). https://www.mdpi.com/topics/Software_Engineering_Applications. Important Dates March 26, 2023: Deadline for abstract and paper submission April 16, 2023: Notification of Acceptance May 7, 2023: Submission deadline for the final version of the Proceeding Paper (hard deadline) May 7, 2023: Registration ends (hard deadline). July 3-6, 2023: SEPA@ICCSA 2023 Conference in Athens, Greece Organizing Chair Sanjay Misra Ostfold University, Halden, Norway ssopam@gmail.com Program Chair Lov Kumar National Institute of Technology, Kurukshetra, India lovkumar@nitkkr.ac.in Rytis Maskeliunas Kaunas University of Technology, Lithuania rytis.Maskeliunas@ktu.lt International Programme Committee Members Raj Kumar Buyya, University of Melbourne, Australia Mario Fusani, National Research Council of Italy Daniel Rodríguez, University of Alcalá, Spain Robertas Damasevicius, Kaunas University of Technology, Lithuania Reda Alhajj, University of Calgary, Canada Emilia Mendes, Blekinge Institute of Technology, Sweden Vahid Garousi, Queen's University Belfast, UK Broderick Crawford, Pontificia Universidad Catolica De Valparaiso, PUCV, Chile Michel dos Santos Soares, Federal University of Sergipe, Brazil V. B. Singh, JNU, Delhi, India José Alfonso Aguilar,Universidad Autónoma de Sinaloa, Maxico Ricardo Soto, Pontificia Universidad Catolica De Valparaiso,Chile Eduardo Guerra, National Institute of space research, Sao Jose, Brazil Murat Koyuncu, Atilim University, Turkey Rytis Maskeliunas, Kaunas University of Technology, Lithuania Tolga Pustali, Cankaya University, Turkey Matthew O. Adigun, University of Zululand, South Africa Cristina Casado Lumbreras, Universidad Carlos III de Madrid, Spain Ibrahim Akman, Atilim University, Ankara, Turkey Marco Crasso, UNICEN University, Argentina Markus Holopainen, University of Helsinki, Finland Takashi Michikawa, Research Center for Advanced Science and Technology (RCAST), Japan Cristian Mateos, UNICEN University, Argentina Pham Quoc Trung, HCMC University of Technology, HCMC, Vietnam Alejandro Zunino, UNICEN University, Argentina Eudisley Anjos, Federal University of Paraiba (UFPB) – Brazil Ravin Ahuja, University Of Delhi, India Rinkaj Goyal, Guru Gobind Singh Indraprastha University, India Hector Florez, Ph.D. Universidad Distrital Francisco José de Caldas, Colombia Jeong Ah Kim. Catholic Kwandong University, Gangneun, Korea Adewole Adewumi, Algonquin College, Canada Matthew Adigun, University of Zululand, South Africa Luis Fernandez Sanz, Universidad de Alcala, Spain Ayush Dogra, CSIR-CSIO, Chandigarh, India Ayan Chatterjee, Simula Research Laboratory, Norway Hasan Ogul, Østfold University, Halden, Norway