-------------------------------------------------------------- IEEE SMARTCOMP 2019 Call for Papers 12-15 June 2019, Washington DC, USA http://www.smart-comp.org --------------------------------------------------------------

SMARTCOMP is the premier conference on smart computing. Smart computing is based on the synergistic combination of advances in Sensor-based technologies, the Internet of Things (IoT), Cyber-Physical Systems, Edge computing, Big Data analytics, Machine Learning, Cognitive Computing, and Artificial Intelligence.

Smart computing is a multidisciplinary domain. Applications of smart computing can be found in different societal domains including, but not limited to, transportation, energy, environmental protection, smart and connected communities, healthcare, banking, entertainment, and social media. Algorithmic and system advancements of cloud computing, mobile/pervasive computing, cyber-physical systems, sensor networking and social computing are taking smart computing to a new dimension and improving our ways of living.

​SMARTCOMP 2019 is the 5th edition of the conference and will held in Washington, USA and will include smart computing innovations pertaining to pervasive/ubiquitous computing, cloud computing, sensor networks, internet of things, big data analytics, security and privacy, social computing, cognitive computing, cyber-physical systems and their application and validation within smart computing environments. This includes applications such as smart buildings, smart cities, smart grids, precision agriculture and other innovations contributing to smart living. Submission Guidelines Paper submissions must be no longer than 8 pages and formatted according to the two-column IEEE proceedings template. IEEE provides corresponding formatting templates at IEEE conference template. Make sure to use the conference mode of the template, i.e., LaTeX users must use the conference option of the IEEEtran document class.

Papers must be submitted electronically as a single PDF file on US Letter size paper (not A4), with all fonts embedded (the PDF-A standard complies with that). Prior to submission, ensure that any running headers/footers, page numbering, as well as blue underlining for URLs and email addresses has been removed.

All submitted papers will be subject to peer reviews by Technical Program Committee members and other experts in the field. All presented papers will be published in the conference proceedings and submitted to the IEEE Xplore Digital Library.

Topics ------ SMARTCOMP 2019 solicits submissions that address the fundamental questions of smart computing, namely how to design and build smart computing systems and how to use computing technology for resource sustainability to improve the human experience. Submissions should thus match to at least one of the following three major fields of interest:

SMART COMPUTING CONCEPTS, MODELS AND ALGORITHMS: ----------------------------------------------- Future Smart Computing Paradigms Models of Smart Environments Algorithms for Smart Computing AI and Machine Learning in Smart Computing Edge computing platforms and algorithms

SMART COMPUTING SYSTEMS: ------------------------ Security, Privacy, and Economics in Smart Environments Cyber-physical System Platforms for Smart Environments Middleware Platforms for Smart Environments Mobile and Ubiquitous Platforms for Smart Environments

SMART COMPUTING TECHNOLOGIES AND APPLICATIONS: ---------------------------------------------- Smart Precision Agriculture Smart Transportation Smart FinTech Smart Food-Energy-Water Nexus/Life-cycle analysis Smart Health Smart Communities Smart Human Environments, Entertainment, and Social Activities Smart Energy Management and Analytics

Organizing Committee -------------------- General Co-Chairs: Aryya Gangopadhyay (University of Maryland Baltimore County, USA) Antonio Puliafito (University of Messina, Italy)

Technical Program Co-Chairs: Raghu Ganti (IBM T. J. Watson Research Center, USA) Julie McCann (Imperial College London, UK)

Workshops Co-Chairs: Dario Bruneo (University of Messina, Italy) Christine Julien (University of Texas at Austin, USA)

Keynote Co-Chairs: Mudhakar Srivatsa (IBM T J Watson Research Center)

WIP and Demo Chair: Shiqiang Wang (IBM T J Watson Research Center)

PhD Forum Chair: Nirupam Roy (University of Illinois Urbana–Champaign, USA)

Publication Chair: TBC

Registration and Finance Chair: Carmen Au (Hong Kong Polytechnic University, Hong Kong) Maciej Zawodniok (Missouri University of Science and Technology, USA)

Publicity Co-Chairs: Baek-Young Choi (University of Missouri - Kansas City, USA) Hemant Purohit (George Mason University, USA) Francesca Righetti (University of Pisa, Italy) Hesheng Wang (Shanghai Jiao Tong University, China)

Local Arrangement Chair: Nirmalya Roy (University of Maryland Baltimore County, USA)

Web Chair: Sreenivasan Ramasamy Ramamurthy (University of Maryland Baltimore County, USA) Anamika Paul Rupa (University of Maryland Baltimore County, USA)

Steering Committee ------------------ Jiannong Cao (Hong Kong Polytechnic University, Hong Kong) Sajal K. Das (Missouri University of Science and Technology, USA)

TPC --- Christian Becker, University of Mannheim Paolo Bellavista, University of Bologna Dario Bruneo, University of Messina Alessandra De Paola, University of Palermo Wan Du, University of California at Merced, USA Angelo Furno, IFSTTAR-France Mohammad Hajiesmaili, The Chinese University of Hong Kong Fanxin Kong, University of Pennsylvania Ulf Kulau, TU Braunschweig Symeon Papavassiliou, National Technical University of Athens Kyung-Joon Park, DGIST Lucas Pereira, Madeira Interactive Technologies Institute (M-ITI) Dirk Pesch, Nimbus Centre For Embedded Systems Research, Cork Institute of Technology Carlo Puliafito, University of Pisa Andreas Reinhardt, TU Clausthal Nirmalya Roy, University of Maryland Baltimore County Nishanth Sastry, KCL Vijay Srinivasan, Samsung R&D Neeraj Suri, TU Darmstadt Hwee-Pink Tan, Singapore Management University Athena Vakali, Aristotle University of Thessaloniki Carlo Vallati, Department of Information Engineering, University of Pisa Desheng Zhang, Rutgers Eugenio Zimeo, University of Sannio

Important Dates --------------- Paper Registration Deadline: 28 January 2019 Paper Submission Deadline: 11 February 2019 Acceptance Notification: 29 March 2019 Camera Ready Deadline: 28 April 2019

Venue ----- The 5th IEEE International Conference on Smart Computing (SMARTCOMP 2019) will be held at Washington DC, USA.

Contact ------- For any Information about the conference, please contact the ​TPC Co-Chairs: Raghu Ganti or Julie McCann.