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When Jul 3, 2023 - Jul 6, 2023 Where Athens, Greece Submission Deadline Mar 26, 2023 Notification Due Apr 16, 2023 Final Version Due May 7, 2023 *Categories* http://www.wikicfp.com/cfp/allcat software applications http://www.wikicfp.com/cfp/call?conference=software%20applications artificial intelligence http://www.wikicfp.com/cfp/call?conference=artificial%20intelligence advanced applications http://www.wikicfp.com/cfp/call?conference=advanced%20applications software engineering http://www.wikicfp.com/cfp/call?conference=software%20engineering

Call For Papers

SEPA 2023: 15th International Symposium on Software Engineering Processes and Applications Publisher- Springer LNCS, Special issues- in Several SCIE/SCOPUS Indexed Journal

The conference is planned to be organized in Blended form (physical presentation and online presentations).

The accepted papers will be published in Lecture Notes in Computer Science by Springer https://sites.google.com/view/ssepa/home http://www.iccsa.org/workshops

Following the grand success of SEPA 2022(Malaga, Spain), SEPA 2021(BLENDED MODE) and SEPA 2020(Online), SEPA 2019 (in Saint Petersburg, Russia), SEPA 2018(In Melbourne, Australia), SEPA 2017(in Trieste, Italy), SEPA 2016 (in Beijing, China), SEPA 2015 (in Banff, Canada), SEPA 2014 (in Guimaraes, Portugal), SEPA 2013 (in Ho Chi Ming, Vietnam), SEPA 2012 (in Salvador, Brazil), SEPA 2011 (in Santander, Spain), SEPA 2010 (in Fukuoka, Japan), SEPA 2009 (in Sowon, Korea), SEPA 2022 (in conjunction with ICCSA 2022) is scheduled to be held during July 3 - 6, 2023 in collaboration with the National Technical University of Athens and the University of the Aegean, Athens, Greece.

Submission deadline: March 26, 2023

About the Workshop and Topics

Software Engineering Processes and Applications (SEPA: 2023) is aimed to provide a forum to scientists/researchers/engineers/practitioners and academicians to share their ideas, experiences, and research in the field of software engineering processes and applications. SEPA 2023 covers all the frontier issues and trends in modern software development processes. It includes process models, the development processes for different software platforms (e.g., social networks, cloud), a process for adaptive, dependable, embedded systems, agile development, software engineering practices, requirements, system, and design engineering including architectural design, component-level design, formal methods, software modeling, testing strategies and tactics, process and product metrics, Web Engineering, project management, risk management, and configuration management. SEPA also invites papers for the development process of the software/software systems in application areas e.g. agriculture, aviation industry, business, cyber-crime, education, government, military, etc.

SEPA invites you to submit theme papers that describe original and significant contributions in all the above-mentioned areas of software engineering processes. The paper submitted to SEPA 2023 must not be submitted elsewhere, either in a conference or journal, and should be 12 - 16 pages (LNCS style). Papers selected after peer review will be included in the Lecture Notes in Computer Science published by Springer (only after completing the registration) and presented online.

Publication

All contributions will be reviewed by international program committee members and judged on their quality and relevance. The accepted papers for SEPA 2023 will be published in Lecture Notes in Computer Science as a book series of Computational Science and Its Applications: ICCSA. Please note that one of the authors of the accepted paper should be registered and supposed to present the paper at the conference (virtual presentation is allowed for authors who cannot attend the conference). The extended version of selected papers will also be invited for publication in several journals (All Web of Science and SCOPUS-indexed journals), including the best papers in SCIE-indexed journals*.

*Special issues In SCIE Journals- Information Technology And Controls, Applied Science, Electronics are confirmed for best papers of the software engineering symposiums(SEPA & ISSQ) and workshop(TTSDP)@ICCSA 2023). https://www.mdpi.com/topics/Software_Engineering_Applications

Submission

Please submit your paper through ICCSA 2023 conference website. Submission site: http://ess.iccsa.org/cgi-bin/login.py

while submitting to the conference site, please select the track of your submission, "15th International Symposium on Software Engineering Processes and Applications (SEPA 2023)".

Important Dates: March 26, 2023: Deadline for abstract and paper submission April 16, 2023: Notification of Acceptance May 7, 2023: Submission deadline for the final version of the Proceeding Paper (hard deadline) May 7, 2023: Registration ends (hard deadline). July 3-6, 2023: SEPA@ICCSA 2023 Conference in Athens, Greece

International Program Committee

Organizing Chair (Contact)

Sanjay Misra Department of Computer Science and Communication Østfold University College, Halden, Norway ssopam@gmail.com

Programme Committee Chair

Robertas Damasevicius Department of Software Engineering Kaunas University of Technology, Kaunas, Lithuania robertas.damasevicius@ktu.lt

International Programme Committee Members

Raj Kumar Buyya, University of Melbourne, Australia Mario Fusani, National Research Council of Italy Daniel Rodríguez, University of Alcalá, Spain Robertas Damasevicius, Kaunas University of Technology, Lithuania Reda Alhajj, University of Calgary, Canada Emilia Mendes, Blekinge Institute of Technology, Sweden Vahid Garousi, Queen's University Belfast, UK Broderick Crawford, Pontificia Universidad Catolica De Valparaiso, PUCV, Chile Michel dos Santos Soares, Federal University of Sergipe, Brazil V. B. Singh, JNU, Delhi, India José Alfonso Aguilar,Universidad Autónoma de Sinaloa, Maxico Ricardo Soto, Pontificia Universidad Catolica De Valparaiso,Chile Eduardo Guerra, National Institute of space research, Sao Jose, Brazil Murat Koyuncu, Atilim University, Turkey Rytis Maskeliunas, Kaunas University of Technology, Lithuania Tolga Pustali, Cankaya University, Turkey Matthew O. Adigun, University of Zululand, South Africa Cristina Casado Lumbreras, Universidad Carlos III de Madrid, Spain Ibrahim Akman, Atilim University, Ankara, Turkey Marco Crasso, UNICEN University, Argentina Markus Holopainen, University of Helsinki, Finland Takashi Michikawa, Research Center for Advanced Science and Technology (RCAST), Japan Cristian Mateos, UNICEN University, Argentina Pham Quoc Trung, HCMC University of Technology, HCMC, Vietnam Alejandro Zunino, UNICEN University, Argentina Eudisley Anjos, Federal University of Paraiba (UFPB) – Brazil Ravin Ahuja, University Of Delhi, India Rinkaj Goyal, Guru Gobind Singh Indraprastha University, India Hector Florez, Ph.D. Universidad Distrital Francisco José de Caldas, Colombia Jeong Ah Kim. Catholic Kwandong University, Gangneun, Korea Adewole Adewumi, Algonquin College, Canada Matthew Adigun, University of Zululand, South Africa Luis Fernandez Sanz, Universidad de Alcala, Spain Ayush Dogra, CSIR-CSIO, Chandigarh, India Ayan Chatterjee, Simula Research Laboratory, Norway Hasan Ogul, Østfold University, Halden, Norway