*Highlights:* ISSQ covers quality-related issues( standards, frameworks, methods, metrics, reviews, etc., for software, software systems, and software applications in various domains), Publication in the most reputed series of Springer(LNCS), has low registration(*180€*) for online presentation and is indexed in CORE, SCOPUS, and Web of Science

ISSQ 2023: 14th International Symposium on Software Quality[image: Facebook] http://www.facebook.com/sharer.php?u=http://www.wikicfp.com/cfp/servlet/event.showcfp?eventid=171726[image: Twitter] http://twitter.com/share?url=http://www.wikicfp.com/cfp/servlet/event.showcfp?eventid=171726&text=ISSQ%20%202023%20:%2014th%20International%20Symposium%20on%20Software%20Quality[image: LinkedIn] http://www.linkedin.com/shareArticle?mini=true&url=http://www.wikicfp.com/cfp/servlet/event.showcfp?eventid=171726[image: Google] https://plus.google.com/share?url=http://www.wikicfp.com/cfp/servlet/event.showcfp?eventid=171726 Link: https://sites.google.com/view/issq/home

When Jul 3, 2023 - Jul 6, 2023 Where Athens, Greece Submission Deadline Mar 26, 2023 Notification Due Apr 16, 2023 Final Version Due May 7, 2023 *Categories* http://www.wikicfp.com/cfp/allcat software quality assurance http://www.wikicfp.com/cfp/call?conference=software%20quality%20assurance quality standards http://www.wikicfp.com/cfp/call?conference=quality%20standards quality models http://www.wikicfp.com/cfp/call?conference=quality%20models quality practics http://www.wikicfp.com/cfp/call?conference=quality%20practics

Call For Papers

ISSQ 2023: 14th International Symposium on Software Quality(Springer-LNCS) in conjunction with ICCSA 2023

The conference is planned to be organized in Blended form (physical presentation and online presentations).

The accepted papers of ISSQ 2023 will be published in Lecture Notes in Computer Science and an extended version of all papers will be invited to publish in several International Journals- All Web of Science/SCOPUS Indexed Journals. Special issues in SCIE Journals- Information Technology And Controls, Applied Science, Electronics are confirmed for best papers of the software engineering symposiums(SEPA & ISSQ) and workshop(TTSDP)@ICCSA 2023. https://www.mdpi.com/topics/Software_Engineering_Applications).

Following the grand success of ISSQ 2022(Malaga, Spain), ISSQ 2021(Blended form in Cagliari, Italy (2021)), ISSQ 2020 (Online), ISSQ 2019 (in Saint Petersburg, Russia),, ISSQ 2018(In Melbourne, Australia), ISSQ 2017(in Trieste, Italy), SQ 2016(in Beijing, China), SQ 2015(in Banff, Canada), SQ 2014 (in Guimaraes, Portugal), SQ 2013 (in Ho Chi Minh City, Vietnam), SQ 2012 (in Salvador, Brazil), SQ 2011 in conjunction with ICCSA 2011 (in Santander, Spain), and SQ 2009 in ISCIS 2009 (in Middle East Technical University North Cyprus Campus, Cyprus), ISSQ 2023 (in conjunction with ICCSA 2023) is scheduled to be held during July 3 - 6, 2023 in collaboration with the National Technical University of Athens and the University of the Aegean, Athens, Greece.

Submission deadline: March 26, 2023

About the Workshop and Topics

This symposium extends the discussion of software quality issues in modern software development processes. It covers s all the aspects of process and product quality, quality assurance and standards, quality planning, quality control, and software quality challenges. It also covers the frontier issues and trends for achieving quality objectives. It includes the quality management process, the role of software metrics, predictor metrics, and control metrics, the role of measurement in accessing the quality, and limitations.

Topics include (related to quality issues in software, software applications in any related area-cloud, agile, IoT, Big data, smart applications) but not limited to:

1. Software development fundamentals, 2. Extreme Programming (XP), Agile, Scrum, 3. Software requirements techniques, 4. Software testing & QA fundamentals, 5. Software testing models and approaches, 6. Software testing tools and frameworks, 7. Software test design, 8. Types of software maintenance, 9. Software maintenance process models, 10. Software maintenance standards, 11. Software maintenance tools 12. Software Reviews (SR) 13. Software Metrics (SM) 14. Software Process Assessment (SPA) 15. Software Process Improvement (SPI) 16. Software Standardization and Certification

ISSQ: 2023 invites you to submit your work that describes original and significant contributions in all the above-mentioned areas of software engineering processes. The paper submitted to ISSQ 2023 must not be submitted elsewhere, either in a conference or journal. Papers selected after peer review will be included in the conference proceedings (after registration) and presented virtually at the conference.

Publication

All contributions will be peer-reviewed and will be judged on their quality and relevance. The accepted papers for ISSQ 2023 will be published in Proceedings of ICCSA by Springer in Lecture Notes in Computer Science. Please note that one of the authors of the accepted paper must register for the conference. Extended and modified versions of all accepted papers are invited to publish in various journals (all SCIE/Web of Science/SCOPUS/ESCI indexed) including best papers in SCIE-indexed Journals.

Submission

Please submit your paper through ICCSA 2023 conference website.

Submission site: http://ess.iccsa.org/cgi-bin/login.py

IMP: While submitting to the conference site, please check the track of your submission "14th International Symposium on Software Quality (ISSQ 2023)"

Important Dates

March 26, 2023: Deadline for abstract and paper submission April 16, 2023: Notification of Acceptance May 7, 2023: Submission deadline for the final version of the Proceeding Paper (hard deadline) May 7, 2023: Registration ends (hard deadline). July 3-6, 2023: SEPA@ICCSA 2023 Conference in Athens, Greece

Organizing Chair

Sanjay Misra Østfold University, Halden, Norway Contact: sanjay.misra@hiof.no, ssopam@gmail.com

Programme Committee Chair

Luis Fernandez-Sanz Department of Computer Science University De Alcala, Spain luis.Fernandez.sanz@uah.es

International Programme Committee Members

Raj Kumar Buyya, University of Melbourne, Australia Mario Fusani, National Research Council of Italy Daniel Rodríguez, University of Alcalá, Spain Robertas Damasevicius, Kaunas University of Technology, Lithuania Reda Alhajj, University of Calgary, Canada Emilia Mendes, Blekinge Institute of Technology, Sweden Vahid Garousi, Queen's University Belfast, UK Broderick Crawford, Pontificia Universidad Catolica De Valparaiso, PUCV, Chile Michel dos Santos Soares, Federal University of Sergipe, Brazil V. B. Singh, JNU, Delhi, India José Alfonso Aguilar,Universidad Autónoma de Sinaloa, Maxico Ricardo Soto, Pontificia Universidad Catolica De Valparaiso,Chile Eduardo Guerra, National Institute of space research, Sao Jose, Brazil Murat Koyuncu, Atilim University, Turkey Rytis Maskeliunas, Kaunas University of Technology, Lithuania Tolga Pustali, Cankaya University, Turkey Matthew O. Adigun, University of Zululand, South Africa Cristina Casado Lumbreras, Universidad Carlos III de Madrid, Spain Ibrahim Akman, Atilim University, Ankara, Turkey Marco Crasso, UNICEN University, Argentina Markus Holopainen, University of Helsinki, Finland Takashi Michikawa, Research Center for Advanced Science and Technology (RCAST), Japan Cristian Mateos, UNICEN University, Argentina Pham Quoc Trung, HCMC University of Technology, HCMC, Vietnam Alejandro Zunino, UNICEN University, Argentina Eudisley Anjos, Federal University of Paraiba (UFPB) – Brazil Ravin Ahuja, University Of Delhi, India Rinkaj Goyal, Guru Gobind Singh Indraprastha University, India Hector Florez, Ph.D. Universidad Distrital Francisco José de Caldas, Colombia Jeong Ah Kim. Catholic Kwandong University, Gangneun, Korea Adewole Adewumi, Algonquin College, Canada Matthew Adigun, University of Zululand, South Africa Luis Fernandez Sanz, Universidad de Alcala, Spain Ayush Dogra, CSIR-CSIO, Chandigarh, India Ayan Chatterjee, Simula Research Laboratory, Norway Hasan Ogul, Østfold University, Halden, Norway