Call for papers: The 25th IEEE International Conference on High Performance Computing and Communications (HPCC 2023), 17-21 Dec. 2023, Melbourne, Australia. Website: www.swinflow.org/confs/2023/hpcc Key dates: Submission Deadline: August 25, 2023 (11:59pm UTC/GMT) Notification: October 15, 2023 Final Manuscript Due: October 30, 2023 Submission site: http://www.swinflow.org/confs/2023/hpcc/submission.htm Publication: Proceedings will be published by IEEE CS Press. Distinguished papers will be invited to special issues of selected journals listed on the conference website. =========== Introduction With the rapid growth in computing and communications technology, the past decade has witnessed a proliferation of powerful parallel and distributed systems and an ever increasing demand for practice of high performance computing and communications (HPCC). HPCC has moved into the mainstream of computing and has become a key technology in determining future research and development activities in many academic and industrial branches, especially when the solution of large and complex problems must cope with very tight timing schedules. Among a series of highly successful International Conferences on High Performance Computing and Communications (HPCC), HPCC conference comes to its 25th edition of a forum for engineers and scientists in academia, industry, and government to address the resulting profound challenges and to present and discuss their new ideas, research results, applications and experience on all aspects of high performance computing and communications. IEEE HPCC is sponsored by IEEE, IEEE Computer Society, and IEEE Technical Committee on Scalable Computing (TCSC). Scope and Topics Topics of particular interest include, but are not limited to: 1. Parallel and distributed system architectures 2. Languages and compilers for high performance computing 3. Parallel and distributed software technologies 4. Parallel and distributed algorithms 5. Embedded systems 6. Peer-to-peer computing 7. Cluster computing 8. Web services and Internet computing 9. Cloud computing 10. Utility computing 11. Performance evaluation and measurement 12. Tools and environments for software development 13. Distributed systems and applications 14. High-performance scientific and engineering computing 15. Database applications and data mining 16. Biological/molecular computing 17. Collaborative and cooperative environments 18. Mobile computing and wireless communications 19. Computer Networks 20. Telecommunications 21. Pervasive/ubiquitous computing and intelligence 22. Autonomic, reliability and fault-tolerance 23. Trust, security and privacy Submission Guidelines Submissions must include an abstract, keywords, the e-mail address of the corresponding author and should not exceed 8 pages for main conference, including tables and figures in IEEE CS format. The template files for LATEX or WORD can be downloaded here. All paper. submissions must represent original and unpublished work. Each submission will be peer reviewed by at least three program committee members. Submission of a paper should be regarded as an undertaking that, should the paper be accepted, at least one of the authors will register for the conference and present the work. Submit your paper(s) in PDF file at the submission site: http://www.swinflow.org/confs/2023/hpcc/submission.htm. Publications Accepted and presented papers will be included into the IEEE Conference Proceedings published by IEEE CS Press. Authors of accepted papers, or at least one of them, are requested to register and present their work at the conference, otherwise their papers may be removed from the digital libraries of IEEE CS and EI after the conference. Distinguished papers will be invited to special issues of selected journals listed on the conference website. General Chairs Xian-He Sun, Illinois Institute of Technology, USA Beniamino Di Martino, Universita' della Campania "Luigi Vanvitelli", Italy Laurence T. Yang, St. Francis Xavier University, Canada Program Chairs Muneeb Hassan, Deakin University, Australia Carson Leung, University of Manitoba, Canada