********************************************************************************** INTERNATIONAL CONFERENCE ON CHANGING LANDSCAPE IN THE SEMICONDUCTOR PACKAGING
Date: December 12-13, 2022 Location: Madeira, Portugal Website: http://wsconf.org/Conference/CLSP **********************************************************************************
Semiconductor Packaging is progressively driving chip development, and the heterogeneous mix is at the front line of these mechanical advances that are expanding the intricacy of semiconductor plans and testing. To assist with beating this test, chip originators are sending state-of-the-art advancements like enormous information and computerized reasoning (AI) to make testing more proficient and powerful. The Digital Transformation of Electronics Packaging, especially of ICs (Integrated Circuits), Sensors and MEMS (Micro-Electro-Mechanical Systems), MOEMS (Micro-Optoelectronic Mechanical Systems), and Photonics passes on is acquiring and more importance in the present business applications. Particularly for AI, AR/VR, and IoT the presentation, form factor, and cost are huge markers. Scaling down and an expanding level of joining at bundling level targets greater usefulness on less space, which is promising higher framework execution, more modest framework size, and lower framework cost. This requires a framework-level methodology with Chip-Package-Board co-plan and co-improvement with close participation along with the total semiconductor inventory network. Changing Landscape in the Semiconductor Packaging (CLSP) Conference is devoted to uniting countless different academic occasions for show inside the meeting program. Occasions will run throughout a range of time during the gathering relying upon the number and length of the introductions. With its great, it offers an extraordinary benefit for understudies, scholastics and semiconductor’s industry scientists.
Important Dates: ---------------- - Paper Submission Due: September 19, 2022 - Acceptance Notification: October 10, 2022 - Final Manuscript Due: November 18, 2022 Publication ---------------- All CLSP 2022 accepted papers will be published by Elsevier Science in the open-access Procedia Computer Science series on-line. Procedia Computer Science is hosted by Elsevier on www.Elsevier.comhttp://www.elsevier.com/ and on Elsevier content platform ScienceDirect (www.sciencedirect.com< http://www.sciencedirect.com/%3E), and will be freely available worldwide. All papers in Procedia will be indexed by Scopus (www.scopus.com< http://www.scopus.com/%3E) and by Thomson Reuters? Conference Proceeding Citation Index ( http://thomsonreuters.com/conference-proceedings-citation-index/). All papers in Procedia will also be indexed by Scopus (www.scopus.com< http://www.scopus.com/%3E) and Engineering Village (Ei).This includes EI Compendex (www.ei.org/compendexhttp://www.ei.org/compendex). Moreover, all accepted papers will be indexed in DBLP (http://dblp.uni-trier.de/). The papers will contain linked references, XML versions and citable DOI numbers. Selected papers will be invited for publication, in the special issues of: - International Journal of Intellectual Property Enforcement, Technology Transfer and Innovation in China's Semiconductor Industry, SSRN ( https://www.journals.elsevier.com/journal-of-public-transportation) Papers on either completed or ongoing research are invited in the following and related tracks: http://wsconf.org/Conference/CLSP CLSP 2022 will be held in the city of Madeira. It is an autonomous region of Portugal and is an archipelago comprising 4 islands off the northwest coast of Africa. Madeira is home to The University of Madeira created in 1988 in Funchal, Madeira.
Conference Tracks =============== Track 1: HETEROGENEOUS INTEGRATION (HI)
Track 2: ADVANCED PACKAGING ROADMAP AND MARKET UPDATES • The Growing Momentum of Heterogeneous Integration • Challenges for Heterogeneous Integration in Package – Applications • Driving Materials and Processes towards Diversity • Micro Balling on Chips with a High Ball-count for Space Applications • Big Data and Vehicle Analytics • Vehicular Networks • Security and Safety
Track 3: PACKAGING TECHNOLOGY & PROCESSES • Active Mold Packaging for Novel Antenna-in-Package Interconnection and Manufacturing • High Throughput & High Yield Heterogeneous Integration with Implemented Metrology for Collective D2W Bonding • High Throughput & High Yield Heterogeneous Integration with Implemented Metrology for Collective D2W Bonding
Track 4: PACKAGE SIMULATION, EVALUATION & CHARACTERIZATION • Heterogeneous Integration Test Impacts • 3D Bump Metrology and Inspection • Intelligent Infrastructure and Guidance Systems • Intertwined development of manufacturing processes and test technologies – a prerequisite for future success in advanced packaging • Virtual Prototyping for System-in-Package with Heterogeneous Integration
Track 5: CASE STUDIES OF ENABLING DIGITALIZATION IN KEY INDUSTRIES WITH ADVANCED PACKAGING SOLUTIONS
Track 6: UPDATES IN MANUFACTURING EQUIPMENT WITH ADVANCED CAPABILITIES • Processing of new functional materials • Manufacturing process IP
Track 7: DESIGN FOR RELIABILITY AND PERFORMANCE • EDA (Electronic Design Automation) • Simulation tools and methods for enhancing SiP • Chip-Package-Board co-design
Committees ==========
Committee Members:
Dr Panagiotis Alevyzakis, Universita degli Studi Guglielmo Marconi, Italy.
CONTACT For more information, please send an email to clsp@wsconf.org https://wsconf.org