computational.science March 2023

computational.science@lists.iccsa.org

13 participants
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TTSDP(Springer: LNCS):15th International Workshop on Tools and Techniques in Software Development Process(Springer(LNCS):)
by Sanjay Misra 22 Mar '23

22 Mar '23

*Highlights:* TTSDP 2023 covers tools and techniques for real-life and industrial applications, Publication in the most reputed series of Springer(LNCS), has low registration(*180€*) for online presentations, and is indexed in CORE, SCOPUS, and Web of Science TTSDP 2023: 15th International Workshop on Tools and Techniques in Software Development Process[image: Facebook] <http://www.facebook.com/sharer.php?u=http://www.wikicfp.com/cfp/servlet/eve…>[image: Twitter] <http://twitter.com/share?url=http://www.wikicfp.com/cfp/servlet/event.showc…>[image: LinkedIn] <http://www.linkedin.com/shareArticle?mini=true&url=http://www.wikicfp.com/c…>[image: Google] <https://plus.google.com/share?url=http://www.wikicfp.com/cfp/servlet/event.…> Link: https://sites.google.com/site/tandtinsdp/home When Jul 3, 2023 - Jul 6, 2023 Where Athens, Greece Submission Deadline Mar 26, 2023 Notification Due Apr 16, 2023 Final Version Due May 7, 2023 *Categories* <http://www.wikicfp.com/cfp/allcat> software industry <http://www.wikicfp.com/cfp/call?conference=software%20industry> industrial applications <http://www.wikicfp.com/cfp/call?conference=industrial%20applications> software techniques <http://www.wikicfp.com/cfp/call?conference=software%20techniques> software tools <http://www.wikicfp.com/cfp/call?conference=software%20tools> Call For Papers TTSDP 2023: 15th International Workshop on Tools and Techniques in Software Development Process The conference is planned to be organized in Blended form (physical presentation and online presentations). 15th International Workshop on "Tools and Techniques in Software Development Process" in conjunction with The 2023 International Conference on Computational Science and Its Applications (ICCSA 2023). It will be held during July 3 - 6, 2023, in collaboration with the National Technical University of Athens and the University of the Aegean, Athens, Greece. https://sites.google.com/site/tandtinsdp/home Accepted papers will be published in Lecture Notes in Computer Science by Springer. The extended version of all presented papers will also be invited for publication in International Scientific Journals(All indexed in SCOPUS/Web of Science/ECIE). https://www.mdpi.com/topics/Software_Engineering_Applications Submission deadline: March 26, 2023 About the Workshop and Topics The Tools and Techniques in Software Development Processes (TTSDP 2023) provide a forum for researchers, and practitioners to share their new achievements, tools, and techniques in the field of the software development process. TTSDP especially invites experience papers from industry and academia, short papers, reports, surveys, working papers/work in progress, and industrial reports. Review/Comment papers are also welcome with the limitation that the paper should be on a general problem/topic in the field (no comments are allowed on a particular paper). TTSDP covers all the aspects of the development process: process models, agile development, software engineering practices, requirements, system, and design engineering, including architectural design, software modeling, testing strategies and tactics, process and product metrics for each phase of software development, component-based software engineering, software quality, verification, validation techniques, and software project management. TTSDP 2023 invites you to submit your work that describes original and significant contributions in all areas of the software development process. The paper submitted to TTSDP 2023 must not submit elsewhere, either in a conference or journal, and should be in IEEE style. Papers selected after peer review will be included in the conference proceedings and presented virtually at the conference. TTSDP 2023 invites you to submit three different types of session papers (8 to 18 pages long) on all the above-mentioned topics: Research papers((12-18 pages in LNCS Format)): Papers that describe original and significant contributions in all areas of the software development process. Experience paper (8-11 pages in LNCS Format): papers from the field describing real-world experience related to the software development process. Short paper and reports(8-11 pages in LNCS Format): Papers that allow the explanation of ideas that are not yet fully validated. Review articles (not on a particular paper), comparative studies, and survey reports are welcome. The paper submitted to TTSDP 2023 must not have been submitted elsewhere, either in a conference or journal, and must be in LNCS style. Papers selected after review will be included in the conference proceedings and presented orally at the conference. Publication All accepted workshop (TTSDP) papers will be included in the proceeding of ICCSA 2022, published by IEEE Xplore. One of the authors of the accepted paper is required to register and is expected to present the paper at the conference. Extended and modified versions of all accepted papers are invited to publish in various journals (all Web of Science/SCOPUS/ESCI indexed) including best papers in SCIE indexed Journal. Submission site: http://ess.iccsa.org/cgi-bin/login.py IMP: While submitting to the conference site, please select the track of your submission, "15th International Workshop on Tools and Techniques in Software Development Processes (TTSDP 2023)". Proceedings Format: Please follow the Springer LNCS proceedings guidelines for preparing your paper. https://www.springer.com/gp/computer-science/lncs/conference-proceedings-gu… Special ISSUES: The accepted papers of TTSDP 2023 will be published in Lecture Notes in Computer Science and an extended version of all papers will be invited to publish in several International Journals- All Web of Science/SCOPUS Indexed Journals. Special issues in SCIE Journals- Information Technology And Controls, Applied Science, Electronics are confirmed for best papers of the software engineering symposiums(SEPA & ISSQ) and workshop(TTSDP)@ICCSA 2023). https://www.mdpi.com/topics/Software_Engineering_Applications. Important Dates March 26, 2023: Deadline for abstract and paper submission April 16, 2023: Notification of Acceptance May 7, 2023: Submission deadline for the final version of the Proceeding Paper (hard deadline) May 7, 2023: Registration ends (hard deadline). July 3-6, 2023: SEPA@ICCSA 2023 Conference in Athens, Greece Organizing Chair Sanjay Misra Ostfold University, Halden, Norway ssopam(a)gmail.com Program Chair Lov Kumar National Institute of Technology, Kurukshetra, India lovkumar(a)nitkkr.ac.in Rytis Maskeliunas Kaunas University of Technology, Lithuania rytis.Maskeliunas(a)ktu.lt International Programme Committee Members Raj Kumar Buyya, University of Melbourne, Australia Mario Fusani, National Research Council of Italy Daniel Rodríguez, University of Alcalá, Spain Robertas Damasevicius, Kaunas University of Technology, Lithuania Reda Alhajj, University of Calgary, Canada Emilia Mendes, Blekinge Institute of Technology, Sweden Vahid Garousi, Queen's University Belfast, UK Broderick Crawford, Pontificia Universidad Catolica De Valparaiso, PUCV, Chile Michel dos Santos Soares, Federal University of Sergipe, Brazil V. B. Singh, JNU, Delhi, India José Alfonso Aguilar,Universidad Autónoma de Sinaloa, Maxico Ricardo Soto, Pontificia Universidad Catolica De Valparaiso,Chile Eduardo Guerra, National Institute of space research, Sao Jose, Brazil Murat Koyuncu, Atilim University, Turkey Rytis Maskeliunas, Kaunas University of Technology, Lithuania Tolga Pustali, Cankaya University, Turkey Matthew O. Adigun, University of Zululand, South Africa Cristina Casado Lumbreras, Universidad Carlos III de Madrid, Spain Ibrahim Akman, Atilim University, Ankara, Turkey Marco Crasso, UNICEN University, Argentina Markus Holopainen, University of Helsinki, Finland Takashi Michikawa, Research Center for Advanced Science and Technology (RCAST), Japan Cristian Mateos, UNICEN University, Argentina Pham Quoc Trung, HCMC University of Technology, HCMC, Vietnam Alejandro Zunino, UNICEN University, Argentina Eudisley Anjos, Federal University of Paraiba (UFPB) – Brazil Ravin Ahuja, University Of Delhi, India Rinkaj Goyal, Guru Gobind Singh Indraprastha University, India Hector Florez, Ph.D. Universidad Distrital Francisco José de Caldas, Colombia Jeong Ah Kim. Catholic Kwandong University, Gangneun, Korea Adewole Adewumi, Algonquin College, Canada Matthew Adigun, University of Zululand, South Africa Luis Fernandez Sanz, Universidad de Alcala, Spain Ayush Dogra, CSIR-CSIO, Chandigarh, India Ayan Chatterjee, Simula Research Laboratory, Norway Hasan Ogul, Østfold University, Halden, Norway

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SEPA(Springer:LNCS):15th International Symposium on Software Engineering Processes and Applications
by Sanjay Misra 22 Mar '23

22 Mar '23

*Highlights:* SEPA covers works on software, algorithm and application of AI and computations techniques in any area/domain, Publication in the most reputed series of Springer(LNCS), has low registration(*180€*) for online presentations, and is indexed in CORE, SCOPUS, and Web of Science SEPA 2023: 15th International Symposium Software Engineering Processes and Applications[image: Facebook] <http://www.facebook.com/sharer.php?u=http://www.wikicfp.com/cfp/servlet/eve…>[image: Twitter] <http://twitter.com/share?url=http://www.wikicfp.com/cfp/servlet/event.showc…>[image: LinkedIn] <http://www.linkedin.com/shareArticle?mini=true&url=http://www.wikicfp.com/c…>[image: Google] <https://plus.google.com/share?url=http://www.wikicfp.com/cfp/servlet/event.…> Link: https://sites.google.com/view/ssepa/home When Jul 3, 2023 - Jul 6, 2023 Where Athens, Greece Submission Deadline Mar 26, 2023 Notification Due Apr 16, 2023 Final Version Due May 7, 2023 *Categories* <http://www.wikicfp.com/cfp/allcat> software applications <http://www.wikicfp.com/cfp/call?conference=software%20applications> artificial intelligence <http://www.wikicfp.com/cfp/call?conference=artificial%20intelligence> advanced applications <http://www.wikicfp.com/cfp/call?conference=advanced%20applications> software engineering <http://www.wikicfp.com/cfp/call?conference=software%20engineering> Call For Papers SEPA 2023: 15th International Symposium on Software Engineering Processes and Applications Publisher- Springer LNCS, Special issues- in Several SCIE/SCOPUS Indexed Journal The conference is planned to be organized in Blended form (physical presentation and online presentations). The accepted papers will be published in Lecture Notes in Computer Science by Springer https://sites.google.com/view/ssepa/home http://www.iccsa.org/workshops Following the grand success of SEPA 2022(Malaga, Spain), SEPA 2021(BLENDED MODE) and SEPA 2020(Online), SEPA 2019 (in Saint Petersburg, Russia), SEPA 2018(In Melbourne, Australia), SEPA 2017(in Trieste, Italy), SEPA 2016 (in Beijing, China), SEPA 2015 (in Banff, Canada), SEPA 2014 (in Guimaraes, Portugal), SEPA 2013 (in Ho Chi Ming, Vietnam), SEPA 2012 (in Salvador, Brazil), SEPA 2011 (in Santander, Spain), SEPA 2010 (in Fukuoka, Japan), SEPA 2009 (in Sowon, Korea), SEPA 2022 (in conjunction with ICCSA 2022) is scheduled to be held during July 3 - 6, 2023 in collaboration with the National Technical University of Athens and the University of the Aegean, Athens, Greece. Submission deadline: March 26, 2023 About the Workshop and Topics Software Engineering Processes and Applications (SEPA: 2023) is aimed to provide a forum to scientists/researchers/engineers/practitioners and academicians to share their ideas, experiences, and research in the field of software engineering processes and applications. SEPA 2023 covers all the frontier issues and trends in modern software development processes. It includes process models, the development processes for different software platforms (e.g., social networks, cloud), a process for adaptive, dependable, embedded systems, agile development, software engineering practices, requirements, system, and design engineering including architectural design, component-level design, formal methods, software modeling, testing strategies and tactics, process and product metrics, Web Engineering, project management, risk management, and configuration management. SEPA also invites papers for the development process of the software/software systems in application areas e.g. agriculture, aviation industry, business, cyber-crime, education, government, military, etc. SEPA invites you to submit theme papers that describe original and significant contributions in all the above-mentioned areas of software engineering processes. The paper submitted to SEPA 2023 must not be submitted elsewhere, either in a conference or journal, and should be 12 - 16 pages (LNCS style). Papers selected after peer review will be included in the Lecture Notes in Computer Science published by Springer (only after completing the registration) and presented online. Publication All contributions will be reviewed by international program committee members and judged on their quality and relevance. The accepted papers for SEPA 2023 will be published in Lecture Notes in Computer Science as a book series of Computational Science and Its Applications: ICCSA. Please note that one of the authors of the accepted paper should be registered and supposed to present the paper at the conference (virtual presentation is allowed for authors who cannot attend the conference). The extended version of selected papers will also be invited for publication in several journals (All Web of Science and SCOPUS-indexed journals), including the best papers in SCIE-indexed journals*. *Special issues In SCIE Journals- Information Technology And Controls, Applied Science, Electronics are confirmed for best papers of the software engineering symposiums(SEPA & ISSQ) and workshop(TTSDP)@ICCSA 2023). https://www.mdpi.com/topics/Software_Engineering_Applications Submission Please submit your paper through ICCSA 2023 conference website. Submission site: http://ess.iccsa.org/cgi-bin/login.py while submitting to the conference site, please select the track of your submission, "15th International Symposium on Software Engineering Processes and Applications (SEPA 2023)". Important Dates: March 26, 2023: Deadline for abstract and paper submission April 16, 2023: Notification of Acceptance May 7, 2023: Submission deadline for the final version of the Proceeding Paper (hard deadline) May 7, 2023: Registration ends (hard deadline). July 3-6, 2023: SEPA@ICCSA 2023 Conference in Athens, Greece International Program Committee Organizing Chair (Contact) Sanjay Misra Department of Computer Science and Communication Østfold University College, Halden, Norway ssopam(a)gmail.com Programme Committee Chair Robertas Damasevicius Department of Software Engineering Kaunas University of Technology, Kaunas, Lithuania robertas.damasevicius(a)ktu.lt International Programme Committee Members Raj Kumar Buyya, University of Melbourne, Australia Mario Fusani, National Research Council of Italy Daniel Rodríguez, University of Alcalá, Spain Robertas Damasevicius, Kaunas University of Technology, Lithuania Reda Alhajj, University of Calgary, Canada Emilia Mendes, Blekinge Institute of Technology, Sweden Vahid Garousi, Queen's University Belfast, UK Broderick Crawford, Pontificia Universidad Catolica De Valparaiso, PUCV, Chile Michel dos Santos Soares, Federal University of Sergipe, Brazil V. B. Singh, JNU, Delhi, India José Alfonso Aguilar,Universidad Autónoma de Sinaloa, Maxico Ricardo Soto, Pontificia Universidad Catolica De Valparaiso,Chile Eduardo Guerra, National Institute of space research, Sao Jose, Brazil Murat Koyuncu, Atilim University, Turkey Rytis Maskeliunas, Kaunas University of Technology, Lithuania Tolga Pustali, Cankaya University, Turkey Matthew O. Adigun, University of Zululand, South Africa Cristina Casado Lumbreras, Universidad Carlos III de Madrid, Spain Ibrahim Akman, Atilim University, Ankara, Turkey Marco Crasso, UNICEN University, Argentina Markus Holopainen, University of Helsinki, Finland Takashi Michikawa, Research Center for Advanced Science and Technology (RCAST), Japan Cristian Mateos, UNICEN University, Argentina Pham Quoc Trung, HCMC University of Technology, HCMC, Vietnam Alejandro Zunino, UNICEN University, Argentina Eudisley Anjos, Federal University of Paraiba (UFPB) – Brazil Ravin Ahuja, University Of Delhi, India Rinkaj Goyal, Guru Gobind Singh Indraprastha University, India Hector Florez, Ph.D. Universidad Distrital Francisco José de Caldas, Colombia Jeong Ah Kim. Catholic Kwandong University, Gangneun, Korea Adewole Adewumi, Algonquin College, Canada Matthew Adigun, University of Zululand, South Africa Luis Fernandez Sanz, Universidad de Alcala, Spain Ayush Dogra, CSIR-CSIO, Chandigarh, India Ayan Chatterjee, Simula Research Laboratory, Norway Hasan Ogul, Østfold University, Halden, Norway

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Springer(LNCS):14th International Symposium on Software Quality
by Sanjay Misra 22 Mar '23

22 Mar '23

*Highlights:* ISSQ covers quality-related issues( standards, frameworks, methods, metrics, reviews, etc., for software, software systems, and software applications in various domains), Publication in the most reputed series of Springer(LNCS), has low registration(*180€*) for online presentation and is indexed in CORE, SCOPUS, and Web of Science ISSQ 2023: 14th International Symposium on Software Quality[image: Facebook] <http://www.facebook.com/sharer.php?u=http://www.wikicfp.com/cfp/servlet/eve…>[image: Twitter] <http://twitter.com/share?url=http://www.wikicfp.com/cfp/servlet/event.showc…>[image: LinkedIn] <http://www.linkedin.com/shareArticle?mini=true&url=http://www.wikicfp.com/c…>[image: Google] <https://plus.google.com/share?url=http://www.wikicfp.com/cfp/servlet/event.…> Link: https://sites.google.com/view/issq/home When Jul 3, 2023 - Jul 6, 2023 Where Athens, Greece Submission Deadline Mar 26, 2023 Notification Due Apr 16, 2023 Final Version Due May 7, 2023 *Categories* <http://www.wikicfp.com/cfp/allcat> software quality assurance <http://www.wikicfp.com/cfp/call?conference=software%20quality%20assurance> quality standards <http://www.wikicfp.com/cfp/call?conference=quality%20standards> quality models <http://www.wikicfp.com/cfp/call?conference=quality%20models> quality practics <http://www.wikicfp.com/cfp/call?conference=quality%20practics> Call For Papers ISSQ 2023: 14th International Symposium on Software Quality(Springer-LNCS) in conjunction with ICCSA 2023 The conference is planned to be organized in Blended form (physical presentation and online presentations). The accepted papers of ISSQ 2023 will be published in Lecture Notes in Computer Science and an extended version of all papers will be invited to publish in several International Journals- All Web of Science/SCOPUS Indexed Journals. Special issues in SCIE Journals- Information Technology And Controls, Applied Science, Electronics are confirmed for best papers of the software engineering symposiums(SEPA & ISSQ) and workshop(TTSDP)@ICCSA 2023. https://www.mdpi.com/topics/Software_Engineering_Applications). Following the grand success of ISSQ 2022(Malaga, Spain), ISSQ 2021(Blended form in Cagliari, Italy (2021)), ISSQ 2020 (Online), ISSQ 2019 (in Saint Petersburg, Russia),, ISSQ 2018(In Melbourne, Australia), ISSQ 2017(in Trieste, Italy), SQ 2016(in Beijing, China), SQ 2015(in Banff, Canada), SQ 2014 (in Guimaraes, Portugal), SQ 2013 (in Ho Chi Minh City, Vietnam), SQ 2012 (in Salvador, Brazil), SQ 2011 in conjunction with ICCSA 2011 (in Santander, Spain), and SQ 2009 in ISCIS 2009 (in Middle East Technical University North Cyprus Campus, Cyprus), ISSQ 2023 (in conjunction with ICCSA 2023) is scheduled to be held during July 3 - 6, 2023 in collaboration with the National Technical University of Athens and the University of the Aegean, Athens, Greece. Submission deadline: March 26, 2023 About the Workshop and Topics This symposium extends the discussion of software quality issues in modern software development processes. It covers s all the aspects of process and product quality, quality assurance and standards, quality planning, quality control, and software quality challenges. It also covers the frontier issues and trends for achieving quality objectives. It includes the quality management process, the role of software metrics, predictor metrics, and control metrics, the role of measurement in accessing the quality, and limitations. Topics include (related to quality issues in software, software applications in any related area-cloud, agile, IoT, Big data, smart applications) but not limited to: 1. Software development fundamentals, 2. Extreme Programming (XP), Agile, Scrum, 3. Software requirements techniques, 4. Software testing & QA fundamentals, 5. Software testing models and approaches, 6. Software testing tools and frameworks, 7. Software test design, 8. Types of software maintenance, 9. Software maintenance process models, 10. Software maintenance standards, 11. Software maintenance tools 12. Software Reviews (SR) 13. Software Metrics (SM) 14. Software Process Assessment (SPA) 15. Software Process Improvement (SPI) 16. Software Standardization and Certification ISSQ: 2023 invites you to submit your work that describes original and significant contributions in all the above-mentioned areas of software engineering processes. The paper submitted to ISSQ 2023 must not be submitted elsewhere, either in a conference or journal. Papers selected after peer review will be included in the conference proceedings (after registration) and presented virtually at the conference. Publication All contributions will be peer-reviewed and will be judged on their quality and relevance. The accepted papers for ISSQ 2023 will be published in Proceedings of ICCSA by Springer in Lecture Notes in Computer Science. Please note that one of the authors of the accepted paper must register for the conference. Extended and modified versions of all accepted papers are invited to publish in various journals (all SCIE/Web of Science/SCOPUS/ESCI indexed) including best papers in SCIE-indexed Journals. Submission Please submit your paper through ICCSA 2023 conference website. Submission site: http://ess.iccsa.org/cgi-bin/login.py IMP: While submitting to the conference site, please check the track of your submission "14th International Symposium on Software Quality (ISSQ 2023)" Important Dates March 26, 2023: Deadline for abstract and paper submission April 16, 2023: Notification of Acceptance May 7, 2023: Submission deadline for the final version of the Proceeding Paper (hard deadline) May 7, 2023: Registration ends (hard deadline). July 3-6, 2023: SEPA@ICCSA 2023 Conference in Athens, Greece Organizing Chair Sanjay Misra Østfold University, Halden, Norway Contact: sanjay.misra(a)hiof.no, ssopam(a)gmail.com Programme Committee Chair Luis Fernandez-Sanz Department of Computer Science University De Alcala, Spain luis.Fernandez.sanz(a)uah.es International Programme Committee Members Raj Kumar Buyya, University of Melbourne, Australia Mario Fusani, National Research Council of Italy Daniel Rodríguez, University of Alcalá, Spain Robertas Damasevicius, Kaunas University of Technology, Lithuania Reda Alhajj, University of Calgary, Canada Emilia Mendes, Blekinge Institute of Technology, Sweden Vahid Garousi, Queen's University Belfast, UK Broderick Crawford, Pontificia Universidad Catolica De Valparaiso, PUCV, Chile Michel dos Santos Soares, Federal University of Sergipe, Brazil V. B. Singh, JNU, Delhi, India José Alfonso Aguilar,Universidad Autónoma de Sinaloa, Maxico Ricardo Soto, Pontificia Universidad Catolica De Valparaiso,Chile Eduardo Guerra, National Institute of space research, Sao Jose, Brazil Murat Koyuncu, Atilim University, Turkey Rytis Maskeliunas, Kaunas University of Technology, Lithuania Tolga Pustali, Cankaya University, Turkey Matthew O. Adigun, University of Zululand, South Africa Cristina Casado Lumbreras, Universidad Carlos III de Madrid, Spain Ibrahim Akman, Atilim University, Ankara, Turkey Marco Crasso, UNICEN University, Argentina Markus Holopainen, University of Helsinki, Finland Takashi Michikawa, Research Center for Advanced Science and Technology (RCAST), Japan Cristian Mateos, UNICEN University, Argentina Pham Quoc Trung, HCMC University of Technology, HCMC, Vietnam Alejandro Zunino, UNICEN University, Argentina Eudisley Anjos, Federal University of Paraiba (UFPB) – Brazil Ravin Ahuja, University Of Delhi, India Rinkaj Goyal, Guru Gobind Singh Indraprastha University, India Hector Florez, Ph.D. Universidad Distrital Francisco José de Caldas, Colombia Jeong Ah Kim. Catholic Kwandong University, Gangneun, Korea Adewole Adewumi, Algonquin College, Canada Matthew Adigun, University of Zululand, South Africa Luis Fernandez Sanz, Universidad de Alcala, Spain Ayush Dogra, CSIR-CSIO, Chandigarh, India Ayan Chatterjee, Simula Research Laboratory, Norway Hasan Ogul, Østfold University, Halden, Norway

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The Sixth Workshop on Systems and Network Telemetry and Analytics (ACM SNTA’23)
by Massimo Cafaro 21 Mar '23

21 Mar '23

Call for Papers The Sixth Workshop on Systems and Network Telemetry and Analytics (ACM SNTA’23) in conjunction with ACM HPDC 2023 (http://www.hpdc.org/2023/) Orlando, Florida, United States, June 16 - 23, 2023 Scope: The tasks of systems and network telemetry are a key element for effective operations and management of HPC and distributed computing systems, by offering comprehensive measurement and analysis capabilities to provide the visibility into what is occurring at any time. The tasks will be significantly complicated with the greater complexity of computing systems, increasing network speed, and the newly introduced mobile and IoT devices. Such changes will render the existing telemetry and analysis techniques outdated, and more scalable techniques may be in place for data-driven and deeper data analysis. In addition to the quantitative and qualitative challenges, data pressure in systems and networks also comes from various sources such as sensors, computing systems, networking and security devices, and other emerging computing elements speaking with different syntax and semantics, which makes organizing and incorporating the generated data difficult for extensive analysis. This workshop aims at bridging the systems and network measurement and the latest advances in artificial intelligence and data science technologies, to advance the performance and reliability of HPC and distributed systems. New analysis techniques are needed in the modern world, from the diverse angles of systems/network performance, availability, and security. For example, real-time streaming analytics algorithms and methods need to be explored for estimating network performance and summarizing the traffic variables to capture the network activities due to the network bandwidth increase. Multivariate analysis of telemetric variables may be able to provide an intuitive, comprehensive view of the systems and network dynamics. New logging techniques are also needed in the future with the latest development in the storage and archival technologies. In addition, many applications in this area may need to address the application-specific requirements and challenges. This workshop intends to share visions of investigating new approaches and methods at the intersection of data sciences and HPC/distributed computing systems. Topic of interest (but not limited to): - Systems and network measurement, analysis, and summarization - Data-driven, multivariate, streaming-based data processing - Distributed and federated machine learning - Cybersecurity, forensics, privacy, and anonymization - Smart instruments, edge/fog-systems, and IoTs - Wireless, sensor, 5G/6G networks measurement and analysis - Software/knowledge-defined-* technologies - Advances in network and storage technologies - Intelligent workflow, visualization, and applications - Performance modeling, analysis, and engineering - Design and evaluation of HPC and distributed systems - Best practices and implementations tied to systems/network data analysis Important dates: Submission deadline: March 31, 2023 Author notification: April 14, 2023 Camera-ready deadline: May 2, 2023 Paper submission: All papers must be original and not simultaneously submitted to another journal or conference. Authors are invited to submit either a full (max 8 pages) paper or a short/work-in-progress (max 4 pages) paper. Papers will be peer-reviewed, and accepted papers will be published in the workshop proceedings as part of the ACM digital library. Submission link: https://easychair.org/conferences/?conf=snta23 Organizing Committee Massimo Cafaro, University of Salento, Italy Eric Chan-Tin, Loyola University Chicago, USA Jerry Chou, National Tsing Hua University, Taiwan Jinoh Kim, Texas A&M University-Commerce, USA Contact: SNTA.help(a)gmail.com -- ************************************************************************************** Prof. Massimo Cafaro, Ph.D. Associate Professor of Parallel Algorithms and Data Mining & Machine Learning Head of HPC Lab https://hpc-lab.unisalento.it Director of Master in Applied Data Science Department of Engineering for Innovation University of Salento, Lecce, Italy Via per Monteroni 73100 Lecce, Italy Voice/Fax +39 0832 297371 Web https://www.massimocafaro.it Web https://www.unisalento.it/people/massimo.cafaro E-mail massimo.cafaro(a)unisalento.it E-mail cafaro(a)ieee.org E-mail cafaro(a)acm.org INGV National Institute of Geophysics and Volcanology Via di Vigna Murata 605 Roma CMCC Foundation Euro-Mediterranean Center on Climate Change Via Augusto Imperatore, 16 - 73100 Lecce massimo.cafaro(a)cmcc.it The sum of the intelligence on the planet is a constant; the population is growing. ************************************************************************************** --

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CFP: The 10th Int. Conf. on Future Internet of Things and Cloud (FiCloud 2023)
by MobiWIS Conference 20 Mar '23

20 Mar '23

----------------------Call for Papers [Deadline Extended]--------------------- The 10th International Conference on Future Internet of Things and Cloud (FiCloud 2023) Hybrid Event, Marrakesh, Morocco 14-16 August 2023 http://www.ficloud.org/2023 --------------------------------------------------------------------------------------- The Internet of Things (IoT) vision is to provide a dynamic and global network infrastructure which is characterized by intelligent and self configuring capabilities. IoT is considered as an integral part of the future Internet. It is based on interoperable communication protocols in order to enable the interaction and integration of virtual as well as physical Things such as computers, smart devices, sensors, cars, refrigerators, food packages, medicines, etc. Things can be seamlessly integrated into the information network and interaction can be made through the provision of intelligent interfaces. In not so distant future, IoT will be forcing its way into every aspect of our lives and technologies including smart homes, smart cities, environment and nature, green energy, food, medicine, automotive, aerospace and aviation, telecommunication, and so on. IoT is generally characterized by real world and small Things, limited capacity, constrained devices and the consequential issues such as less reliability, security and privacy. Cloud computing on the other hand deals mainly with virtual world and has unlimited capabilities in terms of storage and processing power. Thus cloud and IoT are the main complementary aspects of the future Internet. IoT can benefit from the unlimited capabilities and resources of cloud computing. Similarly, cloud can benefit from IoT by extending its scope to deal with real world things in a more distributed and dynamic manner. The theme of this conference is to promote the state of the art in scientific and practical research of the IoT and cloud computing. It provides a forum for bringing together researchers and practitioners from academia, industry, and public sector in an effort to present their research work and share research and development ideas in the area of IoT and cloud computing. CONFERENCE TRACKS: - Software Models and Services - Big Data in Cloud and IoT - Security, Privacy and Trust - Context-aware Systems - Networking and Communication Protocols - Performance Modelling and Evaluation - AI and Machine Learning - Energy Efficiency - Cloud and IoT Continuum - Fog and Edge Computing - Industry Track Important Dates: Submission Deadline (Extended): 31 March 2023 Authors Notification: 25 May 2023 Final Manuscript Due: 15 June 2023 Paper submission and Publication: Authors are requested to submit papers reporting original research results and experience. The page limit for full papers is 8 pages and for short papers is 6 pages. Papers should be prepared using IEEE two-column template. See instructions on the conference website link (given above). All papers accepted for this conference are planned to be published in the conference proceedings by the IEEE Computer Society Conference Publishing Service (CPS). The proceedings will be submitted to the IEEE-Xplore and the IEEE Computer Society (CSDL) digital libraries. The proceedings are also submitted for indexing through IEE INSPEC, EI (Compendex), Thomson ISI, and other indexing services. Authors of selected papers will be invited to submit extended versions of their papers for special issues in international journals. For paper submission please, see the conference website.

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CFP: Int. Conf. on Mobile Web and Intelligent Information Systems
by MobiWIS Conference 20 Mar '23

20 Mar '23

------------------------ Call for Papers [Deadline Extended]-------------------- The 19th International Conference on Mobile Web and Intelligent Information Systems (MobiWis 2023) Hybrid Event, Marrakesh, Morocco 14-16 August 2023 http://www.mobiwis.org/2023/ Springer LNCS Series. ----------------------------------------------------------------------------- The areas of the Web, mobile technologies, and information systems have been following a continuous and steady development over a number of years through the innovative research and practices of researchers, developers and practitioners from academia, industry, governmental and scientific organizations. The International Conference on Mobile Web and Intelligent Information Systems (MobiWis) aims to enable synergy between these areas and provides the premier venue to present and discuss latest research and developments related to research issues of the mobile web and the engineering of intelligent and innovative mobile systems and services. The conference comprises a set of carefully selected tracks that focus on the particular challenges regarding mobile Web and intelligent information systems. Topics of conference include (but not limited to): Conference Tracks: - Smart and Intelligent Systems - Software Design and Development - Middleware and SOA - Pervasive and Ubiquitous Applications - Data management - Security, Trust and Privacy - Mobile Commerce and Services - Transforming Technology - HCI in Mobile Applications - Context & Location-aware Services - Network and Communication - Industrial Applications and Demos Important Dates: Submission Deadline (Extended): 31 March 2023 Authors Notification: 25 May 2023 Final Manuscript Due: 15 June 2023 Submission Instructions: Full papers must be in English and must not exceed 12 pages. Short papers should be limited to 8 pages. Papers should be formatted in Springer's LNCS format. See submission instructions on the conference website. Publication: All accepted papers are planned to be included in the conference proceedings published by Springer in the Lecture Notes in Computer Science (LNCS) series. For each accepted paper, at least one author must register for the conference and present the paper. Authors of selected papers will be invited to submit an extended version of their papers for a special issues in international journals (see conference website). Lecture Notes in Computer Science (LNCS) series is indexed by the ISI Conference Proceedings Citation Index - Science (CPCI-S), included in ISI Web of Science, EI Engineering Index (Compendex and Inspec databases), ACM Digital Library, dblp, Google Scholar, Scopus, etc. See LNCS - Information on Abstracting and Indexing ( http://www.springer.com/computer/lncs?SGWID=0-164-6-1068921-0)

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Firm extended Deadline for direct submission - Call for chapters
by mohamed Lahby 20 Mar '23

20 Mar '23

*******Firm extended Deadline for direct submission********* Dear colleagues We are currently working on the elaboration of the book "Combating Cyberbullying in Digital Media with Artificial Intelligence" URL: https://sites.google.com/view/cbai-book/home-page This book will be published by CRC Press, Taylor & Francis, USA (the proposal has already been accepted by the publisher) at the end of November 2023. We are still searching for some chapters for the book, related to: *- Artificial Intelligence for combating Cyberbullying* *- Machine learning for combating Cyberbullying* *- Deep Learning for combating Cyberbullying* - Explainable Artificial Intelligence (XAI) for combating Cyberbullying If you are interested, please you need to submit your manuscript using pdf format at lahby(a)ieee.org before *March 31, 2023* (firm deadline). *There is no charge, it's free* Thank you very much for your collaboration Best regards

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CFP: 2023 IEEE Cloud Computing Conference (Hybrid Event)
by Bahman Javadi 19 Mar '23

19 Mar '23

*Paper submissions are due on March 25, 2023 (one week ahead). So don't miss it! * Best Papers and Best Student Papers AWARDS: https://conferences.computer.org/services/2023/awards/ ****CALL FOR PAPERS**** IEEE CLOUD is the flagship conference in Cloud Computing. You are invited to submit original papers addressing all aspects of cloud innovations ( https://conferences.computer.org/cloud/2023/cfp). You can submit your paper to Easychair <https://easychair.org/conferences/?conf=ieeecloud2023> as a regular paper (7~10 pages), short paper (4~6 pages), or Work-in-Progress paper (up to 3 pages). Topics of interest include but are not limited to the following: ● Cloud & AI ● Infrastructure ● Applications ● Cloud Management and Operations ● Cloud Security ● Cloud Economics ● Cloud as a Service ****IMPORTANT DATES (AT 5:00 AM UTC)**** Paper submissions open: December 1, 2023 UPDATED Paper submissions due: March 25, 2023 UPDATED Final notifications to authors: May 8, 2023

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European project InnoCyPES (Innovative Tools for Cyber-Physical Energy Systems) - Research Grant at the University of Salento, Lecce, Italy
by Massimo Cafaro 17 Mar '23

17 Mar '23

European project InnoCyPES (Innovative Tools for Cyber-Physical Energy Systems) - Research Grant at the University of Salento, Lecce, Italy Who we are The University of Salento is a young dynamic university, keen to expand and to prove itself at a national and international level. Since 1955 the University of Salento has had the aim of promoting knowledge, skill and merit and has offered a large range of educational opportunities. From law to science, economics to engineering, humanities to media studies, the university provides academic pathways to a range of professions as well as post- graduate and specialist courses tailor made to meet the needs of the workplace. Eight Departments providing services and information for students, as well as thirty-three Research Centres throughout the Salento area. The University of Salento has grown rapidly in recent years, consolidating and reinforcing its role as the keystone of the local cultural and social system. It also has a Ph.d. School and Post-graduate schools for Cultural Heritage and for the Legal Professions. The prestigious ISUFI Grandes écoles school offers high-level undergraduate and postgraduate courses for scholarship students to promote excellence. Who we are looking for We are seeking for exceptional, talented applicants committed to work in the context of the European project InnoCyPES (Innovative Tools for Cyber-Physical Energy Systems), a Marie Curie Action Innovative Training Network providing world-leading and transferable scientific training to a new generation of 15 high-achieving early stage researchers (ESRs). In the course of their training, they will study, investigate and improve various facets of digitalized and interconnected energy systems. Supervised by a consortium of prominent and experienced academic institutions, research institutes and industrial partners, they will collaboratively develop a cutting-edge system management platform that covers the entire lifecycle of data for energy system planning, operation and maintenance, based on an understanding of the energy system as a cyber-physical system. The ESR research activity will be carried out on premises mainly at the University of Salento. We invite applications from candidates working in the field of Computer Science, who have experience and strong knowledge with regard to data management (database etc), distributed systems, Peer-to-Peer systems and blockchains, and who have a strong interest in the research topic, covering large scale data management and integration. Excellent programming skills in C/C++ in the Unix environment are also required. We are aware of the fact that knowing all the subjects listed above is even very difficult for a Master of Science student. Therefore, highly motivated students who know some of the above subjects listed above are encouraged to apply. Prospective candidates must not have resided or carried out the main activity of study/work in Italy for more than 12 months during the 3 years preceding the date of the beginning of the contract. Additional requirements are listed in the official public call. The successful candidate will work in close cooperation with prof. Massimo Cafaro and the members of the High Performance Computing Laboratory at the University of Salento. Two secondments of four months each at partners institutions are scheduled, along with the participation in schools and workshops organised within the framework of the InnoCyPES project. Moreover, the candidate will be given ample opportunity to publish his/her scientific results and present them at international conferences. The research grant will cover the ESR position for 30 months. Additional funding may be obtained by project’s partners covering a further six months to be spent in their laboratories. Details Position: research grant at the Department of Engineering for Innovation, University of Salento, Lecce, Italy Duration: 30 months Deadline for application: April 6, 2023 Remuneration: The research grant will last 30 (thirty) months. The annual remuneration, gross of charges to be borne by the beneficiary and inclusive of contributions and social security charges to be borne by the University of Salento, consists of the following items: 1. Living allowance: Euro 40,966.56 (forty thousand nine hundred and sixty-six/56); 2. Mobility allowance: Euro 7.200,00 (seven thousand two hundred/00); 3. Family allowance: 3.1. Euro 0 (zero) per researcher without family obligations; 3.2. Euro 6,000.00 (six thousand/00) for researchers with family obligations (married or with a relationship recognised by Italian law or that of the country of origin or with dependent children). Scientific Supervisor: Prof. Massimo Cafaro Research topic: Large scale data management and integration This is a 30 months “Marie Curie ETN Early Stage Researcher position” on the following topic. The sheer quantum of data being created and collected across jurisdictions requires a carefully planned and proactive approach to data management. The need for fusion and integration of multiple data sources characterized by fragmented data ownership is driving innovative approaches to large scale distributed data management and integration to avoid inconsistent and inaccurate data. The aim is to investigate, design and implement a fully decentralized solution to provide efficient management of dynamically updated information and support for distributed queries. One or more domain specific use cases shall be identified within the context of the project, considering both the current and future needs of some of the involved partners. These nicely fit into the research plan, owing to the need of surveying the user’s requirements to begin with; simultaneously, the uses cases can also be thought of as sources of advanced data management challenges. The official public call is available here (In Italian and English): https://www.unisalento.it/bandi-concorsi/-/bandi/view/66493326 Direct download link: https://www1.unisalento.it/c/document_library/get_file?p_l_id=63872469&fold… Application and declaration forms: https://www1.unisalento.it/c/document_library/get_file?p_l_id=63872469&fold… Prospective candidates can contact prof. Massimo Cafaro at massimo.cafaro(a)unisalento.it for additional information and, if required, for assistance in compiling the application. -- ************************************************************************************** Prof. Massimo Cafaro, Ph.D. Associate Professor of Parallel Algorithms and Data Mining & Machine Learning Head of HPC Lab https://hpc-lab.unisalento.it Director of Master in Applied Data Science Department of Engineering for Innovation University of Salento, Lecce, Italy Via per Monteroni 73100 Lecce, Italy Voice/Fax +39 0832 297371 Web https://www.massimocafaro.it Web https://www.unisalento.it/people/massimo.cafaro E-mail massimo.cafaro(a)unisalento.it E-mail cafaro(a)ieee.org E-mail cafaro(a)acm.org INGV National Institute of Geophysics and Volcanology Via di Vigna Murata 605 Roma CMCC Foundation Euro-Mediterranean Center on Climate Change Via Augusto Imperatore, 16 - 73100 Lecce massimo.cafaro(a)cmcc.it The sum of the intelligence on the planet is a constant; the population is growing. ************************************************************************************** --

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MobiSPC 2023 CFPs: The 20th International Conference on Mobile Systems and Pervasive Computing, MobiSPC: Change of conference date and due dates
by Ali BENZERBADJ 16 Mar '23

16 Mar '23

---------------------------------------------------------------------------- The 20th International Conference on Mobile Systems and Pervasive Computing (MobiSPC) Halifax, Nova Scotia, Canada August 14-16, 2023 http://cs-conferences.acadiau.ca/mobispc-23/ ---------------------------------------------------------------------------- Mobile Systems and Pervasive Computing (MobiSPC) have evolved into an active area of research and development. This is due to the tremendous advances in a broad spectrum of technologies and topics, including wireless networking, mobile and distributed computing, sensor systems, RFID technology, and the ubiquitous mobile phone. MobiSPC- solicits papers that focus on the theory, systems, practices and challenges of providing users with a successful mobile or wireless experience. This includes how mobile computing changes how people pervasively use their computers, computing resources and applications, as well the systems, services and technologies enabling those applications. MobiSPC-2023 will provide a leading-edge, scholarly forum for researchers, engineers, and students alike to share their state-of-the-art research and developmental work in the broad areas of pervasive computing and mobile systems. Important Dates ---------------- - Workshop Proposal Due: February 20, 2023 - Paper Submission Due: April 4, 2023 (Extended) - Acceptance Notification: May 15, 2023 - Final Manuscript Due: June 12, 2023 Publication ------------ All MobiSPC 2023 accepted papers will be published by Elsevier Science in the open-access Procedia Computer Science series on-line. Procedia Computer Science is hosted by Elsevier on www.Elsevier.com and on Elsevier content platform ScienceDirect (www.sciencedirect.com), and will be freely available worldwide. All papers in Procedia will be indexed by Scopus ( www.scopus.com) and by Thomson Reuters' Conference Proceeding Citation Index (http://thomsonreuters.com/conference-proceedings-citation-index/). All papers in Procedia will also be indexed by Scopus (www.scopus.com) and Engineering Village (Ei) (www.engineeringvillage.com). This includes EI Compendex (www.ei.org/compendex). Moreover, all accepted papers will be indexed in DBLP (http://dblp.uni-trier.de/). The papers will contain linked references, XML versions and citable DOI numbers. You will be able to provide a hyperlink to all delegates and direct your conference website visitors to your proceedings. Selected papers will be invited for publication, in the special issues of: - International Journal of Ambient Intelligence and Humanized Computing (IF: 7.104), by Springer (http://www.springer.com/engineering/journal/12652) - International Journal of Computing and Informatics (IF: 0.524), ( http://www.cai.sk/ojs/index.php/cai/index) - International Journal of Transportation Research Part A: Policy and Practice (IF: 5.594), by Elsevier ( https://www.journals.elsevier.com/transportation-research-part-a-policy-and…) - International Journal of Computer and Telecommunications Networking (IF: 3.030) (Pending), Elsevier ( https://www.journals.elsevier.com/computer-networks) MobiSPC 2023 will be held in conjunction with the 18th International Conference on Future Networks and Communications (FNC, http://cs-conferences.acadiau.ca/fnc-23/). MobiSPC 2023 will be held in Halifax Nova Scotia, Canada. Halifax is located on the east coast of Canada and is approximately a 6-hour flight from London, UK and a 2-hour flight from Toronto, Ontario. Halifax is a vibrant and modern city which is home to multiple academic institutions and where visitors can enjoy a variety of activities and entertainment from whale watching to Jazz festivals to world-class cuisine. Halifax is also home to the Maritime Museum of the Atlantic which contains the world largest collection of Titanic artifacts. Nova Scotia is a picturesque province with many National and Provincial parks, and as stated in the Guinness Book of World Records, has the highest tides in the world. Conference Tracks --------------- - Component-based IoT - Enabling Technologies and Emerging Topics - Internet of Things - Mobile Cloud Computing - Mobile Data Management - Mobile Social Networking - Pervasive Computing - Smart Cities and Ubiquitous Climate Change Management - Smart Communities and Ubiquitous Systems - Mobile Systems and Applications Committees: ----------- General Chair Hossam Hassanein, Queen's University, Canada Program Chairs Ridha Khedri, McMaster University, Canada Ansar Yasar, Hasselt University, Belgium Workshops' Chair Stephane Galland, UTBM, France Tracks Chairs Muhammad Adnan, Hasselt University, Belgium Salimur Choudhury, Lakehead University, Canada Stéphane Galland, Université de Technologie de Belfort-Montbéliard, France Uneb Gazger, University of Bahrain, Bahrain Camille Kamga, The City College of New York, USA Faouzi Kammoun, ESPRIT, Tunisia Hamid Mcheick, UQAC, Canada Wendy Osborn, University of Lethbridge, Canada Aneta Poniszewska-Maranda, Lodz University of Technology, Poland Rahim Rahmani, Stockholm University, Sweden Cristina Seceleanu, Malardalen University, Sweden Qussai Yaseen, Jordan University of Science and Technology, Jordan International Journals Chair Atta Badii, Reading University, UK Publicity Chairs Ali Benzerbadj, University of Ain Temouchent Belhadj Bouchaib, Algeria Sohail Jabbar, The University of Faisalabad, Pakistan Orven E. Llantos, MSU-IIT, Philippines Jake Speiran, Acadia University, Canada Advisory Committee Nirwan Ansari, New Jersey Institute of Technology, USA Flavien Balbo, Ecole Nationale Superieure des Mines de Saint Etienne, France Erol Gelenbe, Imperial College, UK Vincenzo Loia, University of Salerno, Italy Ralf Steinmetz, Technische Universitaet Darmstadt, Germany David Taniar, Monash University, Australia Mohamed Younis, University of Maryland Baltimore County, USA Technical Program Committee http://cs-conferences.acadiau.ca/mobispc-23/#programCommittees Steering Committee Chair Elhadi Shakshuki, Acadia University, Canada

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computational.science March 2023